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{{cc-nanolab}}
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Furnace_LPCVD_Nitride click here]'''
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Furnace_LPCVD_Nitride click here]'''
<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>


[[Category: Equipment|Thin film F]]
[[Category: Equipment|Thin film F]]
[[Category: Thin Film Deposition|LPCVD nitride]]
[[Category: Thin Film Deposition|LPCVD nitride]]
[[Category: Furnaces|LPCVD nitride]]
[[Category: Furnaces|LPCVD nitride]]
==Deposition of Silicon Nitride using LPCVD==


[[image:DC_nyhed_3.jpg|320x320px|right|thumb|6" LPCVD nitride furnace (E3) located in cleanroom E-6]]
[[image:DC_nyhed_3.jpg|320x320px|right|thumb|6" LPCVD nitride furnace (E3) located in cleanroom E-6]]
[[image:Furnace_nitride1.jpg|300x300px|right|thumb|4" LPCVD nitride furnace (B2) located in cleanroom B-1]]
[[image:Furnace_nitride1.jpg|300x300px|right|thumb|4" LPCVD nitride furnace (B2) located in cleanroom B-1]]
==Deposition of Silicon Nitride using LPCVD==


DTU Nanolab has two LPCVD (Low Pressure Chemical Vapour Deposition) furnaces <!--[[Specific Process Knowledge/Thin film deposition/B2 Furnace LPCVD Nitride|LPCVD furnaces]]--> for deposition of silicon nitride:
DTU Nanolab has two LPCVD (Low Pressure Chemical Vapour Deposition) furnaces <!--[[Specific Process Knowledge/Thin film deposition/B2 Furnace LPCVD Nitride|LPCVD furnaces]]--> for deposition of silicon nitride:
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[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=250 6" LPCVD nitride furnace (E3)]
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=250 6" LPCVD nitride furnace (E3)]


[https://labmanager.dtu.dk/function.php?module=MiscDocument&view=docs&page_id=387 Furnace computer manual]
[https://labmanager.dtu.dk/d4Show.php?id=1926 Furnace computer manual]




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*[[/Deposition of low stress nitride using the 6" LPCVD nitride furnace|Deposition of low stress nitride using the 6" LPCVD nitride furnace ]]
*[[/Deposition of low stress nitride using the 6" LPCVD nitride furnace|Deposition of low stress nitride using the 6" LPCVD nitride furnace ]]
*[[/Deposition of stoichiometric nitride using the 6" LPCVD nitride furnace|Deposition of stoichiometric nitride using the 6" LPCVD nitride furnace <span style="color:Red">(Only available for 6" wafers and special permission required)</span>]]
*[[/Deposition of stoichiometric nitride using the 6" LPCVD nitride furnace|Deposition of stoichiometric nitride using the 6" LPCVD nitride furnace <span style="color:Red">(4" wafers need a special permission using as a back up of 4" LPCVD nitride furnace, B2)</span>]]


*[[/Using LPCVD silicon nitride as a masking material for KOH etching|Using LPCVD silicon nitride as a masking material for KOH etching]]
*[[/Using LPCVD silicon nitride as a masking material for KOH etching|Using LPCVD silicon nitride as a masking material for KOH etching]]


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==
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