Specific Process Knowledge/Thin film deposition/Deposition of Niobium: Difference between revisions
No edit summary |
|||
| (3 intermediate revisions by 2 users not shown) | |||
| Line 1: | Line 1: | ||
= Deposition of Niobium = | |||
Niobium can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the deposition equipment. | Niobium can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the deposition equipment. | ||
| Line 30: | Line 25: | ||
!Pre-clean | !Pre-clean | ||
|Ar ion bombardment | |Ar ion bombardment | ||
| | |none | ||
|RF Ar clean | |RF Ar clean | ||
| Line 96: | Line 91: | ||
| Substrates get heated during the deposition. | | Substrates get heated during the deposition. | ||
For 100 nm Nb at 2 Å/s, the substrate reached about 105 °C. | For 100 nm Nb at 2 Å/s, the substrate reached about 105 °C. | ||
| | |||
| | | | ||
|} | |} | ||