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|-
|-
|Au||   0,125"|| 99,999% || 314 || 20
|Au||   0,125"|| 99,999% || 314 || 20
|-
|Co|| 0,0625"|| 99,95% || 126 || 10
|-
|-
|Cr||   0,125"|| 99,95% || 251 || 20
|Cr||   0,125"|| 99,95% || 251 || 20
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|-
|-
|Al/Cu99,5/0,5%||   0,250"|| 99,99% || 314 || 20
|Al/Cu99,5/0,5%||   0,250"|| 99,99% || 314 || 20
|-
|Co/Fe  50/50%||   0,0625"|| 99,95% || 126 || 10
|-
|Co/Fe  80/20%||   0,0625"|| 99,95% || 126 || 10
|-
|Co/Fe  90/10%||   0,0625"|| 99,95% || 126 || 10
|-
|-
|Cr2O3||   0,125" + Cu backing plate|| 99,8% || 63 || 0.5
|Cr2O3||   0,125" + Cu backing plate|| 99,8% || 63 || 0.5
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|-
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|Ni/Co50/50%|| 0,0625"|| 99,95% || 126 || 20
|Ni/Co50/50%|| 0,0625"|| 99,95% || 126 || 20
|-
|Ni/Co  50/50%|| 0,125"|| 99,95% || 126 || 20
|-
|-
|Ni/Fe    80/20%|| 0.125"|| 99,95% || 126 || 20
|Ni/Fe    80/20%|| 0.125"|| 99,95% || 126 || 20
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|style=background:WhiteSmoke; color:black|'''magn.'''
|style=background:WhiteSmoke; color:black|'''magn.'''
|style=background:WhiteSmoke; color:black|'''Relative depostion rate'''
|style=background:WhiteSmoke; color:black|'''Relative depostion rate'''
|-
|Co||Cobalt||Low||0.73
|-
|-
|Cr||Chromium||Med||0.87
|Cr||Chromium||Med||0.87
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|Ni80Fe20||Permalloy||High||0.80
|Ni80Fe20||Permalloy||High||0.80
|}
|}


==Overview of the performance of Sputter-System(Lesker) and some process related parameters==
==Overview of the performance of Sputter-System(Lesker) and some process related parameters==
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!style="background:silver; color:black;" align="left"|Purpose  
!style="background:silver; color:black;" align="left"|Purpose  
|style="background:LightGrey; color:black"|Deposition of magnetic metals and dielectrica ||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Deposition of various materials ||style="background:WhiteSmoke; color:black"|
*Sputtering of magnetic metals and Silicon
* Metals including alloys and magnetic materials
* Dielectrica including silica and alumina.
* Semiconductors including silicon
* See tables above and ask staff if there is a material you would like to deposit which you do not see listed.
|-
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Performance
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Performance
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* usually room temp
* usually room temp
* Sample can be heated to more than 400°C *
* We used to have sample heating to to more than 400°. However, this is not possible at the moment.
* For sputtering with sample heating, please see [[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3) ]]
|-
|-
|style="background:LightGrey; color:black"|Process pressure
|style="background:LightGrey; color:black"|Process pressure
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Ar
*Ar
*N<math>_2</math>
*N<sub>2</sub>
*O<math>_2</math>
*O<sub>2</sub>
*2%O<math>_2</math> in Ar
*2 % O<sub>2</sub> in Ar
* mixtures of the above
* mixtures of the above
|-
|-
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon wafers
*Silicon wafers
*and almost any other
*and almost any other as long as it does not degas.
*See cross-contamination sheet [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=244]
|-  
|-  
| style="background:LightGrey; color:black"|Material allowed on the substrate
| style="background:LightGrey; color:black"|Material allowed on the substrate
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*almost any  
*almost any as long as it does not degas.
|-  
|-  
|}
|}
''*'' For temperatures above 400&deg;C, please contact thinfilm@nanolab.dtu.dk, as higher temperatures may damage the machine.
 
 
==Maximum Power Calculation==
 
* <math>PD</math> - Power density (fundamental constant given by a supplier)
* <math>P(W)</math> - Power (W) from power supply
* <math>A(inch^2)</math> - Area of the target
 
------------------------------------------------------------------------------------------------------------
 
<math> PD=\frac{P(W)}{A(inch^2)}</math>  &#8658;   <math>P(W)=PD\cdot A(inch^2)=PD\cdot\frac{\pi d^2}{4}</math>
 
<ul>
<li><p> <b><span style="color: green">d=2" (2-inch target)</span></b> <math>P(W)=3.14\cdot PD</math>  </p></li>
<li><p> <b><span style="color: green">d=3" (3-inch target)</span></b> <math>P(W)=7.065\cdot PD</math>  </p></li>
<li><p> <b><span style="color: green">d=4" (4-inch target)</span></b> <math>P(W)=12.56\cdot PD</math>  </p></li>
<li><p> <b><span style="color: green">d=6" (6-inch target)</span></b> <math>P(W)=28.26\cdot PD</math>  </p></li>
</ul>
--------------------------------------------------
Value of the <math>PD</math> is material dependent and can be found on KJLC homepage
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