Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
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= DRIE-Pegasus 2= | = DRIE-Pegasus 2= | ||
{{Author-jmli1}} | {{Author-jmli1}} | ||
[[ | [[File:Pegasus 2 operator.jpg|right|400px|The DRIE-Pegasus 2 operator station and load lock in the DTU Nanolab cleanroom A-1. {{photo1}}]] | ||
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager:''' | '''The user manual(s), user APV(s), technical information and contact information can be found in LabManager:''' | ||
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Pegasus 2 stands out as it is a dedicated research tool where much fewer processes are allowed. As such, the instrument will not be released for general use for a wide range of applications. | Pegasus 2 stands out as it is a dedicated research tool where much fewer processes are allowed. As such, the instrument will not be released for general use for a wide range of applications. | ||
Whereas Pegasus 1 and 3 are intended to serve as stable platforms with limited or no changes in hardware, Pegasus 2 has been subject to experiments. For instance, as of the end of 2020 the instrument has been set up to run [ | Whereas Pegasus 1 and 3 are intended to serve as stable platforms with limited or no changes in hardware, Pegasus 2 has been subject to experiments. For instance, as of the end of 2020 the instrument has been set up to run [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-2#Publications_on_the_CORE_process|the CORE process]]. This means that comparing to [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-1|DRIE-Pegasus 1]] and [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-3|DRIE-Pegasus 3]], Pegasus 2 and its allowed usage have been modified (this list is not complete - see the complete list in the table below). For instance: | ||
[[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-3|DRIE-Pegasus 3]], Pegasus 2 and its allowed usage have been modified (this list is not complete - see the complete list in the table below). For instance: | |||
# The C<sub>4</sub>F<sub>8</sub> MFC has been disconnected to maintain a carbon-free (carbon containing masks are allowed) chamber. | # The C<sub>4</sub>F<sub>8</sub> MFC has been disconnected to maintain a carbon-free (carbon containing masks are allowed) chamber. | ||
# The RF generator supplying the power to the coil has been disconnected thus allowing only processes driven by the platen generator. | # The RF generator supplying the power to the coil has been disconnected thus allowing only processes driven by the platen generator. | ||
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{{Template:Peg2configheader1 | {{Template:Peg2configheader1 | ||
|TableHeader= | |TableHeader= 7: Currently valid from May 17 2023 onwards | ||
}} | }} | ||
{{Template:Peg2configcontent1 | {{Template:Peg2configcontent1 | ||
|ItemName= Available gasses and gas chemistry | |ItemName= Available gasses and gas chemistry | ||
|ItemConfiguration= '''Available gasses:''' | |ItemConfiguration= '''Available gasses:''' | ||
* SF<sub>6</sub>: 50 sccm | * SF<sub>6</sub>-1: 1200 sccm | ||
* SF<sub>6</sub>-2: 50 sccm | |||
* O<sub>2</sub>: 50 sccm | * O<sub>2</sub>: 50 sccm | ||
* Ar: 283 | * Ar: 283 | ||
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* C<sub>4</sub>F<sub>8</sub> (H<sub>2</sub> currently fitted but closed) : 0 sccm | * C<sub>4</sub>F<sub>8</sub> (H<sub>2</sub> currently fitted but closed) : 0 sccm | ||
* CO<sub>2</sub>: (It is not in the software) | * CO<sub>2</sub>: (It is not in the software) | ||
|ItemComment= | |ItemComment=Only SF<sub>6</sub> and O<sub>2</sub> are used for Si, PR, and Cr etch. The rest is only make-up | ||
}} | }} | ||
{{Template:Peg2configcontent1 | {{Template:Peg2configcontent1 | ||
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{{Template:Peg2configcontent1 | {{Template:Peg2configcontent1 | ||
|ItemName= Recipes | |ItemName= Recipes | ||
|ItemConfiguration= | |ItemConfiguration= Do ''not'' run any recipes from the folder called 'z-Archive'. | ||
|ItemComment= | |ItemComment= The configuration of Pegasus 2 has changed over time (hence this table) so there is a large number of recipes that are no longer working. Also, some inappropriate settings in the some recipes (mainly with respect to the pressure control) have been identified. This is why it was decided that all existing (by autumn 2022) recipes be relocated to the folder called 'z-Archive' from which they must serve ''only'' as backup. To run a recipe in the z-Archive folder, it must be verified by the dry etch group and copied to another folder (typically user\group\****). | ||
}} | }} | ||
{{Template:Peg2configcontent1 | {{Template:Peg2configcontent1 | ||
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}} | }} | ||
{{Template:Peg2configcontent1 | {{Template:Peg2configcontent1 | ||
|ItemName= Electrostatic clamping | |ItemName= Electrostatic clamping and helium backside cooling are again mandatory. | ||
|ItemConfiguration= The processes run in Pegasus 2 operate at such low powers that they do not require very efficient cooling. It has therefore been decided that the following options/procedures | |ItemConfiguration= The processes run in Pegasus 2 operate at such low powers that they do not require very efficient cooling. It has therefore been decided that the following options/procedures | ||
* Electrostatic clamping of carriers/substrates | * Electrostatic clamping of carriers/substrates | ||
* Helium backside cooling | * The Helium backside cooling is kept at 5 Torr instead of the usual 10 Torr on the other Pegasus tools. | ||
* Using bonding procedures such as droplets of Galden oil to increase thermal contact between chips and carrier | * Using bonding procedures such as droplets of Galden oil to increase thermal contact between chips and carrier | ||
will no longer be required. | will no longer be required. | ||
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|ItemName= Background knowledge required for safe operation | |ItemName= Background knowledge required for safe operation | ||
|ItemConfiguration= The users and supervisors of Pegasus-2 must carefully read the 4 papers listed in the comments in order to have a correct understanding of the etch process and experimental procedure and how it relates to the Bosch etch performance. | |ItemConfiguration= The users and supervisors of Pegasus-2 must carefully read the 4 papers listed in the comments in order to have a correct understanding of the etch process and experimental procedure and how it relates to the Bosch etch performance. | ||
|ItemComment= | |ItemComment= See the papers in the [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-2#Publications_on_the_CORE_process |section below]]. | ||
}} | }} | ||
|} | |} | ||
=== Publications on the CORE process === | === Publications on the CORE process === | ||
<span id="anchor_CORE1"></span> | |||
The CORE process is described in detail in the publications below: | |||
; Nguyen, V. T. et al.: On the formation of black silicon in SF6-O2 plasma: The clear, oxidize, remove, and etch (CORE) sequence and black silicon on demand | ; Nguyen, V. T. et al.: On the formation of black silicon in SF6-O2 plasma: The clear, oxidize, remove, and etch (CORE) sequence and black silicon on demand | ||
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* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/Black silicon on Demand|Black silicon on Demand]] | * [[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/Black silicon on Demand|Black silicon on Demand]] | ||
* [[/ORE with Al2O3 mask|The ORE process with Al2O3 mask]] | * [[/ORE with Al2O3 mask|The ORE process with Al2O3 mask]] | ||
*[[/Nanoscale silicon nitride etch with SF6|Nanoscale silicon nitride etch with SF6]] | |||