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[[Category: Equipment |Etch DRIE]]
[[Category: Equipment |Etch DRIE]]
[[Category: Etch (Dry) Equipment|DRIE]]
[[Category: Etch (Dry) Equipment|DRIE]]
{{Template:Author-jmli1}}
 
<!--Checked for updates on 24/4-2023 - ok/jmli -->
{{contentbydryetch}}
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*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Isotropic|Isotropic etches]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Isotropic|Isotropic etches]]


More processes, such as for DUV resist, are currently being developed, but they are not quite 'ready for publication' at LabAdviser so please contact Jonas (mailto:jmli@dtu.dk) for more information.
More processes, such as for DUV resist, are currently being developed, but they are not quite 'ready for publication' at LabAdviser so please contact Jonas ([mailto:jmli@dtu.dk jmli@dtu.dk]) for more information.


  <!--  *[[Specific Process Knowledge/Etch/DRIE-Pegasus/slopedsidewalls|Etches that produce positively sloped sidewalls for imprinting purposes]] -->
  <!--  *[[Specific Process Knowledge/Etch/DRIE-Pegasus/slopedsidewalls|Etches that produce positively sloped sidewalls for imprinting purposes]] -->
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=== Advanced Processing - Henri Jansen style ===
=== Advanced Processing - Henri Jansen style ===


[[Template:Author-jmli1]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch silicon nanostructures|Etch silicon nanostructures ]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch silicon nanostructures|Etch silicon nanostructures ]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch high aspect ratio silicon microstructures|Etch high aspect ratio silicon microstructures ]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch high aspect ratio silicon microstructures|Etch high aspect ratio silicon microstructures ]]
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To find information on how to bond wafers or chips to a carrier wafer, click [[Specific Process Knowledge/Etch/DryEtchProcessing/Bonding| here]].
To find information on how to bond wafers or chips to a carrier wafer, click [[Specific Process Knowledge/Etch/DryEtchProcessing/Bonding| here]].


=== Acceptance test ===
The instrument was opened for users in April 2010 when the acceptance test was signed. This was based on the performance of five standard recipes (A, B, C, D and SOI) that are further examined below. The acceptance test report is found [[Media:Pegasus_AcceptanceTest.pdf|here]].


'''Characterisation of etched trenches'''
'''Characterisation of etched trenches'''
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Process log at Nanolab [http://labintra.nanolab.dtu.dk/index.php/Main_Page/Process_Logs/jmli/Pegasus]
Process log at Nanolab [http://labintra.nanolab.dtu.dk/index.php/Main_Page/Process_Logs/jmli/Pegasus]
{{global:Infobox Software/MediaWiki}}
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