Jump to content

Specific Process Knowledge/Etch/DRIE-Pegasus/System-description: Difference between revisions

Jmli (talk | contribs)
Jmli (talk | contribs)
No edit summary
 
(2 intermediate revisions by the same user not shown)
Line 2: Line 2:
<!--Checked for updates on 14/5-2018 - ok/jmli -->
<!--Checked for updates on 14/5-2018 - ok/jmli -->
<!-- Page reviewed 9/8-2022 jmli -->
<!-- Page reviewed 9/8-2022 jmli -->
 
<!--Checked for updates on 4/9-2025 - ok/jmli -->


== Description of the Bosch process at the DRIE-Pegasus ==
== Description of the Bosch process at the DRIE-Pegasus ==
Line 93: Line 93:


== The Picoscope ==
== The Picoscope ==
This section applies to Pegasus 1, 2 and 3.


The process monitoring on Pegasus 1, 2 and 3 has been dramatically improved with the installation of the Picoscope. Click [[Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope|'''HERE''']] to access a page on the Picoscope only.
The process monitoring on Pegasus 1, 2 and 3 has been dramatically improved with the installation of the Picoscope. Click [[Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope|'''HERE''']] to access a page on the Picoscope only.
Line 100: Line 98:
== The Claritas endpoint system ==
== The Claritas endpoint system ==


This section applies to Pegasus 1.
This section applies to Pegasus 1. Too bad that it is empty so far...
 
The plasma of any dry etch process emits light as the gas constituents ( gas molecules, ions and radicals) deexcite from high energy states. Every gas molecule, ions etc. have unique vibrational and rotational energy states.