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[[Category: Equipment |Etch DRIE]]
[[Category: Equipment |Etch DRIE]]
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{{Author-jmli1}}
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= Process optimization using the Picoscope =
= Process optimization using the Picoscope =


Before going into details on why it makes sense to optimize the processes using the picoscope process monitoring, we need to have a look at how monitoring processes is usually done.
Before going into details on why it makes sense to optimize the processes using the picoscope process monitoring, we need to have a look at how monitoring processes is usually done.
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=== Process D4 ===
=== Process D4 ===


After a few years in its original configuration, we decided to upgrade Pegasus 1 with the [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange|High flow plenum]] upgrade to improve the fast switching performance. As a result, the original recipe Process D was changed to Process D4 with faster cycles. The process parameters are listed in the table below.
After a few years in its original configuration, we decided to [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange|'''upgrade Pegasus 1''']] to improve the fast switching performance. As a result, the original recipe Process D was changed to Process D4 with faster cycles. The process parameters are listed in the table below.


{| {{table}}
{| {{table}}
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; Bingdong Chang et al.: DREM: Infinite etch selectivity and optimized scallop size distribution with conventional photoresists in an adapted multiplexed Bosch DRIE process
; Bingdong Chang et al.: DREM: Infinite etch selectivity and optimized scallop size distribution with conventional photoresists in an adapted multiplexed Bosch DRIE process
: Microelectronic Engineering Volume 191, 5 May 2018, Pages 77-83  
: 2018 Microelectronic Engineering Volume 191, 5 May, Pages 77-83  
: https://doi.org/10.1016/j.mee.2018.01.034
: https://doi.org/10.1016/j.mee.2018.01.034
* Bingdong Chang et al.: DREM2: a facile fabrication strategy for freestanding three dimensional silicon micro- and nanostructures by a modified Bosch etch process: https://doi.org/10.1088/1361-6439/aad0c4
* Vy Thi Hoang Nguyen et al.: The CORE Sequence: A Nanoscale Fluorocarbon-Free Silicon Plasma Etch Process Based on SF6/O2 Cycles with Excellent 3D Profile Control at Room Temperature: https://doi.org/10.1149/2162-8777/ab61ed
* Bingdong Chang et al.: Large Area Three-Dimensional Photonic Crystal Membranes: Single-Run Fabrication and Applications with Embedded Planar Defects:
https://doi.org/10.1002/adom.201801176
* Chantal Silvestre et al.: Deep reactive ion etching of ‘grass-free’ widely-spaced periodic 2D arrays, using sacrificial structures: https://doi.org/10.1016/j.mee.2020.111228


*[[Media:Grassfree1.pdf | ]]
; Bingdong Chang et al.: DREM2: A facile fabrication strategy for freestanding three dimensional silicon micro- and nanostructures by a modified Bosch etch process
:  2018 J. Micromech. Microeng. 28 105012
: https://doi.org/10.1088/1361-6439/aad0c4
 
; Vy Thi Hoang Nguyen et al.: The CORE Sequence: A Nanoscale Fluorocarbon-Free Silicon Plasma Etch Process Based on SF6/O2 Cycles with Excellent 3D Profile Control at Room Temperature
: 2020 ECS J. Solid State Sci. Technol. 9 024002
: https://doi.org/10.1149/2162-8777/ab61ed
 
; Bingdong Chang et al.: Large Area Three-Dimensional Photonic Crystal Membranes: Single-Run Fabrication and Applications with Embedded Planar Defects
: 2019, Advanced Optical Materials Volume 7, Issue 2, pp. 1801176
: https://doi.org/10.1002/adom.201801176


*[[Media:3DnanoSi.pdf | ]]
; Chantal Silvestre et al.: Deep reactive ion etching of ‘grass-free’ widely-spaced periodic 2D arrays, using sacrificial structures
*[[Media:CORE1.pdf |  ]]
: 2020, Microelectronic Engineering, Volume 223, 15 February, 111228
*[[Media:DREM1.pdf | Bingdong Chang et al.: DREM: Infinite etch selectivity and optimized scallop size distribution with conventional photoresists in an adapted multiplexed Bosch DRIE process]]
: https://doi.org/10.1016/j.mee.2020.111228
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