Specific Process Knowledge/Back-end processing/Hot Embosser: Difference between revisions

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 == Process information ==
-At the moment there are no set processes for the machine. Each material demands different process parameters, depending on the type of process you are running. For development of process that fits your needs contact for the machine responsible personel, and we will assist you in designing the optimal process
+At the moment there are no set processes for the machine. Each material demands different process parameters, depending on the type of process you are running. For development of a process that fits your needs contact the machine responsible personnel, and we will assist you in designing the optimal process.
 ==Equipment performance and process related parameters==
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 |style="background:LightGrey; color:black"|Temperature
 |style="background:WhiteSmoke; color:black"|
-*0-285 degrees Celsius
+*12°C to 285°C
 |-
 |style="background:LightGrey; color:black"|Pressure
 |style="background:WhiteSmoke; color:black"|
-*1.5-300 kN
+*1,5-300 kN
 |-
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 |style="background:LightGrey; color:black"|Batch size
 |style="background:WhiteSmoke; color:black"|
-*<nowiki>#</nowiki> small samples
+*Small samples
-*<nowiki>#</nowiki> 50 mm wafers
+*50 mm wafers
-*<nowiki>#</nowiki> 100 mm wafers
+*100 mm wafers
-*<nowiki>#</nowiki> 150 mm wafers
+*150 mm wafers
-*<nowiki>#</nowiki> 200 mm wafers
+*200 mm wafers
-*<nowiki>#</nowiki> odd sized samples, contact for the machine responsible personel
+*Odd sized samples, contact for the machine responsible personnel
 |-
 | style="background:LightGrey; color:black"|Allowed materials
@@ Line 76: / Line 76: @@
 *Graphene
 *Metals (Al,Ni....)
-*For other materials contact for machine responsible personel
+*For other materials contact for machine responsible personnel
 |-
 |}
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