Specific Process Knowledge/Bonding/Wafer Bonder 02: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Bonding/Wafer_Bonder_02 click here]''' | '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Bonding/Wafer_Bonder_02 click here]''' | ||
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=Wafer Bonder 02= | |||
[[Image:wafer bonder2.jpg|300x300px|thumb|Wafer Bonder 02: Positioned in cleanroom E-4]] | [[Image:wafer bonder2.jpg|300x300px|thumb|Wafer Bonder 02: Positioned in cleanroom E-4]] | ||
The Wafer bonder 02 is a system for bonding. 3 different types of [[Specific Process Knowledge/Bonding|bonding]] can be done: Anodic, Eutectic and Fusion. Furthermore it is possible to align the wafers one wishes to bond. It is also possible to process and align pieces. | The Wafer bonder 02 is a system for bonding. 3 different types of [[Specific Process Knowledge/Bonding|bonding]] can be done: Anodic, Eutectic and Fusion. Furthermore it is possible to align the wafers one wishes to bond. It is also possible to process and align pieces. | ||
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==Process information== | ==Process information== | ||
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*[[Specific Process Knowledge/Bonding/Fusion bonding|Fusion bonding]] | *[[Specific Process Knowledge/Bonding/Fusion bonding|Fusion bonding]] | ||
*[[Specific Process Knowledge/Bonding/Anodic bonding|Anodic bonding]] | *[[Specific Process Knowledge/Bonding/Anodic bonding|Anodic bonding]] | ||
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==Overview of the performance of the Wafer Bonder 02 and some process related parameters== | ==Overview of the performance of the Wafer Bonder 02 and some process related parameters== | ||
Latest revision as of 18:17, 27 May 2025
The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.
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Wafer Bonder 02
The Wafer bonder 02 is a system for bonding. 3 different types of bonding can be done: Anodic, Eutectic and Fusion. Furthermore it is possible to align the wafers one wishes to bond. It is also possible to process and align pieces.
The user manual, quality control procedure and results, user APV(s), and contact information can be found in LabManager: Equipment info in LabManager
Process information
Types of Bonding
| Purpose | Bonding |
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|---|---|---|
| Performance | Alignment accuracy |
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| Process parameter range | Process Temperature |
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| Process pressure |
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| Piston Force |
| |
| Substrates | Batch size |
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| Substrate material allowed |
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| Material allowed on the substrate |
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