Specific Process Knowledge/Etch/Etching of Silicon/Si etch using ASE: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page% | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20https://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Silicon/Si_etch_using_ASE click here]''' | ||
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==The Bosch process: Etching of silicon== | ==The Bosch process: Etching of silicon== | ||
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*[ | *[https://labmanager.dtu.dk/d4Show.php?id=1607&mach=105 The QC procedure for ASE] | ||
*[ | *[https://labmanager.dtu.dk/view_binary.php?type=data&mach=105 The newest QC data for ASE] | ||
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== Process development == | == Process development == | ||
===Etch of nano sized structures=== | ===Etch of nano sized structures=== | ||
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*See pxnano2 and comparison with nanotech on the Pegasus: [[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano142-pxnano2]] | *See pxnano2 and comparison with nanotech on the Pegasus: [[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano142-pxnano2]] | ||
Older work: | Older work: | ||
Three different examples of etch are shown here. The masking material was zep520A (80 nm). | Three different examples of etch are shown here. The masking material was zep520A (80 nm). | ||
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