Jump to content

Specific Process Knowledge/Etch/DryEtchProcessing: Difference between revisions

← Older edit
VisualWikitext
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,565 edits
No edit summary
Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,305 edits
No edit summary
 
(2 intermediate revisions by one other user not shown)
Line 5: Line 5:


This page contains information that is common to dry etch instruments.  
This page contains information that is common to dry etch instruments.  
[[template:jjsbhfh]]


{|  border ="0" align="left" valign="top"   
{|  border ="0" align="left" valign="top"   
Line 14: Line 11:
|-
|-
| style="background: LightGray"| [[/Comparison| Hardware comparison]]
| style="background: LightGray"| [[/Comparison| Hardware comparison]]
| style="background:#DCDCDC;"| Comparison of the different hardware setups
| style="background:#DCDCDC;"| Comparison of the different hardware setups of our dry etchers
|-
|-
| style="background: LightGray"| [[/Bonding| Using carrier wafer]]
| style="background: LightGray"| [[/Bonding| Using carrier wafer]]
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/DryEtchProcessing"