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Specific Process Knowledge/Etch/AOE (Advanced Oxide Etch): Difference between revisions

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{{cc-nanolab}}
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/AOE_(Advanced_Oxide_Etch) click here]'''  
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/AOE_(Advanced_Oxide_Etch) click here]'''  
[[Category: Equipment|Etch AOE]]
[[index.php?title=Category:Equipment|Etch AOE]]
[[Category: Etch (Dry) Equipment|AOE]]
[[index.php?title=Category:Etch (Dry) Equipment|AOE]]


''This page is written by DTU Nanolab internals if nothing else is stated'' <br>


== Etching using the dry etch technique AOE (Advanced oxide etch) ==
== Etching using the dry etch technique AOE (Advanced oxide etch) ==
[[Image:AOE.jpg|300x300px|thumb|AOE: positioned in cleanroom B-1, photo: DTU Nanolab internal]]
[[Image:AOE.jpg|300x300px|thumb|AOE: positioned in cleanroom B-1, {{photo1}}]]


Name: M/PLEX ICP - AOE (Advanced Oxide Etcher) <br>
Name: M/PLEX ICP - AOE (Advanced Oxide Etcher) <br>
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*H<sub>2</sub>: 0-30 sccm
*H<sub>2</sub>: 0-30 sccm
*He: 0-500 sccm
*He: 0-500 sccm
*N<sub>2</sub>: 0-1000 sccm
*SF<sub>6</sub>: 0-300 sccm
*SF<sub>6</sub>: 0-300 sccm
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