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'''All measurements on this page has been made by Nanolab staff.'''  
'''All measurements on this page has been made by Nanolab staff.'''  


[[Category: Equipment|Etch Wet Chromium]]
[[Category: Etch (Wet) bath|Chromium]]


==Wet etching of Chromium==
==Wet etching of Chromium==
[[Image:Fumehood1-2.jpg|300x300px|thumb|Fume hood 01 or 02 (for acids and bases) in cleanroom D-3 can be used for wet chromium etching.]]
[[File:Si etch 3.png|300x300px |thumb| Work space in Fume Hood 06 in cleanroom D-3 can be used for wet chromium etching - workspace should be booked.]]
Wet etching of chromium at DTU Nanolab is done making your own set up in a beaker in a fume hood - preferably in D-3. You can see the APV [http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 here].


We use the following solution to etch chromium:
We use the following solution to etch chromium:


# Commercial chromium etch (Chrome Etch 18). You can see the KBA [https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K here]
# Commercial chromium etch (Chrome Etch 18). You can see the KBA (needs login to kemibrug) [https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K here]


The etch rate depends on the level of surface oxidation of the chromium metal, but the standard procedure (etch at room temperature: ~22°C) the Etch rate is around 150 nm/min.
The etch rate depends on the level of surface oxidation of the chromium metal, but the standard procedure (etch at room temperature: ~22°C) the Etch rate is around 150 nm/min.
'''Etch in Fume hood'''
Wet etching of chromium in fume hood at DTU Nanolab is done making your own set up in a beaker in a fume hood - preferably fume hood 6 for Si etch 3 in D-3
You can see the APV [https://labmanager.dtu.dk/d4mb/show.php?dokId=4748&mach=368&chpr=0 here].
PECVD SiO2 and LPCVD SiN coated wafers have been immersed in Cr etch 18 for 10min. Thickness wise: absolutely no changes (roughness after etch not measured)
Normally the etch is reused (if you etch Molybdenum never reuse), but if you need to dispose it, collect it in a bottle marked X waste.
'''Etching of Chromium in Acid 1 wetbench 11'''
[[File:Wetbench 11.png|300x300px|thumb|Acid 1 Wetbench 11 in cleanroom D-3 can be used for wet chromium etching of 6" and 8" wafers, after agreement with wetchemistry group.]]
Always make an agreement with Wetchemistry group before training
The bath is for 6" and 8" wafers.
You can see the APV [https://labmanager.dtu.dk/d4mb/show.php?dokId=21726&mach=580 here].


===Overview of the chromium etch process===
===Overview of the chromium etch process===
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|-style="background:silver; color:black"
|-style="background:silver; color:black"
!
!
! Chromium etch 1
! Chromium etch in Fume hood
! Chromium etch Acid 1 wetbench 11
|-  
|-  


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|
|
Etch of chromium
Etch of chromium
|
Etch of Chromium 6" and 8" wafers 
|-
|-


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!Link to safety APV and KBA
!Link to safety APV and KBA
|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 see fumehood APV/manual here].  
|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 see fumehood APV/manual here].  
[https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K see Chrome Etch 18 KBA here]
|[https://labmanager.dtu.dk/d4mb/show.php?dokId=21726&mach=580 see Wetbench 11 APV/manual here].
[https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K see Chrome Etch 18 KBA here]
[https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhESk5HTklNVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K see Chrome Etch 18 KBA here]
|-
|-
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Chemical solution
!Chemical solution
|Chrome Etch 18
|Chrome Etch 18
|Chrome Etch 18
|-
|-
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!Process temperature
!Process temperature
|Room temperature
|Room temperature
 
|Room temperature
|-
|-


|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Possible masking materials
!Possible masking materials
|Photoresist (1.5 µm AZ5214E)
|Photoresist (1.5 µm AZ5214E)
|Photoresist (1.5 µm AZ5214E)
|-
|-
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Etch rate
!Etch rate
|~ 150 nm/min at 22°C
|~ 150 nm/min at 22°C
|~ 150 nm/min at 22°C
|-
|-
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!Batch size
!Batch size
|1-7 4" wafers at a time
|1-7 4" wafers at a time
|Up to 5 6" or 8" wafers at a time
|-
|-


|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Size of substrate
!Size of substrate
|Any size and number that can go inside the beaker in use
|Any size and number that can go inside the beaker in use
|6" and 8" 
|-
|-


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|No restrictions.  
|No restrictions.  
Make a note on the beaker of which materials have been processed.
Make a note on the beaker of which materials have been processed.
|
See the [https://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=580 Cross Contamination Sheet] for Acid 1
|-
|-
|}
|}
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