Specific Process Knowledge/Lithography/Coaters/GammaDUV: Difference between revisions

Latest revision as of 11:16, 3 February 2023

Spin coater: Süss stepper

This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system.

The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager:

Equipment info in LabManager - requires login

DUV resist overview

The spinning process will be performed by the customer together with the Photolith group of Nanolab. In case you would like to do DUV lithography please contact Lithography team, who will consult you and run your wafers together with you.

Bottom Anti Reflection Coating (BARC):

Manufacturers website: DUV 42S-6
Datasheet: DUV42S-6 - requires login

Positive DUV resist for spin coating in 600-300nm thickness range:

Manufacturers website: KrF M230Y
Datasheet: KrF M230Y - requires login

Positive DUV resist for spin coating in 1600-800nm thickness range:

Manufacturers website: KrF M35G
Datasheet: KrF M35G - requires login

Negative DUV resist for spin coating in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range:

Manufacturers website: UVN2300-0.8
Datasheet: UVN2300-0.8 - requires login

Process information

Equipment performance and process related parameters

Purpose		Spin coating and soft baking of BARC Spin coating and soft baking of DUV resists Post exposure baking
Resist		BARC DUV42S-6 Positive tone resist KRF M230Y Positive tone resist KRF M35G Negative tone resist UVN2300-0.8
Performance	Coating thickness	BARC DUV42S-6 60-90nm Positive tone resist KRF M230Y 300-600nm Positive tone resist KRF M35G 800-1600nm Negative tone resist UVN2300-0.8 200-1400nm
Process parameters	Spin speed	10 - 5000 rpm
	Spin acceleration	100 - 10000 rpm/s
	Hotplate temperature	175°C for BARC baking 130°C for positive tone resist soft baking and post exposure baking 100°C for negative tone resist soft baking and post exposure baking
Substrates	Substrate size	100 mm wafers 150 mm wafers 200 mm wafers (requires tool change)
	Allowed materials	Any standard cleanroom material
	Batch	1 - 25

@@ Line 4: / Line 4: @@
 This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch  4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system.
-'''The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager:'''
+The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager:
-Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=279 LabManager]
+Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=279 LabManager] - '''requires login'''
 {{:Specific Process Knowledge/Lithography/Resist/DUVresist}}
@@ Line 14: / Line 15: @@
 *[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Quality_Control_(QC)|Quality Control (QC)]]
 *[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Standard_Processes|Standard Processes]]
-*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Syringe_processes|Syringe processes]]
-===Quality Control (QC)===
-{| border="1" cellspacing="2" cellpadding="2" colspan="3"
-|bgcolor="#98FB98" |'''Quality Control (QC) for Spin coater: Süss Stepper - BARC DUV42S-6'''
-|-
-|
-*[http://labmanager.dtu.dk/d4Show.php?id=5123&mach=279 The QC procedure for Spin coater: Süss Stepper]<br>
-*[http://labmanager.dtu.dk/view_binary.php?fileId=4212 The newest QC data for Spin coater: Süss Stepper]
-{| {{table}}
-| align="center" |
-{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:400px"
-! QC Recipe:
-! (1201) DCH 150mm BARC 65nm
-|-
-|Substrate size
-|6"
-|-
-|Resist volume
-|3 ml
-|-
-|Spin-off speed
-|4700 rpm
-|-
-|Spin-off time
-|30 s
-|-
-|Soft bake temperature
-|175°C, contact
-|-
-|Soft bake time
-|60 s
-|-
-|}
-| align="center" valign="top"|
-{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px"
-!QC limits
-!Spin coater: Süss Stepper - BARC DUV42S-6
-|-
-|Nominal film thickness
-|65 nm
-|-
-|Film thickness deviation from nominal
-|<15%
-|-
-|Film thickness non-uniformity
-|<5%
-|-
-|}
-|-
-|}
-Spin-off speed will be adjusted if film thickness is outside the limit.
-|}
-{| border="1" cellspacing="2" cellpadding="2" colspan="3"
-|bgcolor="#98FB98" |'''Quality Control (QC) for Spin coater: Süss Stepper - BARC DUV42S-6'''
-|-
-|
-*[http://labmanager.dtu.dk/d4Show.php?id=5123&mach=279 The QC procedure for Spin coater: Süss Stepper]<br>
-*[http://labmanager.dtu.dk/view_binary.php?fileId=4212 The newest QC data for Spin coater: Süss Stepper]
-{| {{table}}
-| align="center" |
-{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:400px"
-! QC Recipe:
-! (1202) DCH 100mm BARC 65nm
-|-
-|Substrate size
-|4"
-|-
-|Resist volume
-|1.6 ml
-|-
-|Spin-off speed
-|3000 rpm
-|-
-|Spin-off time
-|30 s
-|-
-|Soft bake temperature
-|175°C, contact
-|-
-|Soft bake time
-|60 s
-|-
-|}
-| align="center" valign="top"|
-{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px"
-!QC limits
-!Spin coater: Süss Stepper - BARC DUV42S-6
-|-
-|Nominal film thickness
-|65 nm
-|-
-|Film thickness deviation from nominal
-|<15%
-|-
-|Film thickness non-uniformity
-|<5%
-|-
-|}
-|-
-|}
-Spin-off speed will be adjusted if film thickness is outside the limit.
-|}
-===Standard processes===
-BARC DUV42S-6 coating sequences:
-*'''(1201) DCH 150mm BARC 65nm''' Dispense 3ml@1000rpm; spin-off 30s@4700rpm; softbake 60s@175°C
-*'''(1202) DCH 100mm BARC 65nm''' Dispense 1.6ml@1000rpm; spin-off 30s@3000rpm; softbake 60s@175°C
-KRF M230Y coating sequences:
-*'''(1301) DCH 150mm M230Y 360nm''' Dispense 3ml@1000rpm; spin-off 30s@2500rpm; softbake 90s@130°C
-*'''(1302) DCH 100mm M230Y 360nm''' Dispense 1ml@1000rpm; spin-off 30s@2500rpm; softbake 90s@130°C
-KRF M35G coating sequences:
-*'''(1401) DCH 150mm M35G 750nm''' Dispense 3ml@1000rpm; spin-off 60s@5000rpm; softbake 90s@130°C
-*'''(1402) DCH 100mm M35G 750nm''' Dispense 1ml@1000rpm; spin-off 60s@5000rpm; softbake 90s@130°C
-*'''(1403) DCH 150mm M35G 1000nm''' Dispense 3ml@1000rpm; spin-off 60s@2630rpm; softbake 90s@130°C
-*'''(1404) DCH 100mm M35G 1000nm''' Dispense 1ml@1000rpm; spin-off 60s@2630rpm; softbake 90s@130°C
-*'''(1405) DCH 150mm M35G 1400nm''' Dispense 3ml@1000rpm; spin-off 60s@1310rpm; softbake 90s@130°C
-*'''(1406) DCH 100mm M35G 1400nm''' Dispense 1ml@1000rpm; spin-off 60s@1310rpm; softbake 90s@130°C
 ===Equipment performance and process related parameters===
-{| border="2" cellspacing="0" cellpadding="2"
+{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"
 !style="background:silver; color:black;" align="center" width="60"|Purpose
@@ Line 152: / Line 28: @@
 |-
-!style="background:silver; color:black;" align="center" width="60"|Resist
+!style="background:silver; color:black; width="60"|Resist
 |style="background:LightGrey; color:black"|
-|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+|style="background:WhiteSmoke; color:black" colspan="2"|
 *BARC DUV42S-6
 *Positive tone resist KRF M230Y
@@ Line 162: / Line 38: @@
 !style="background:silver; color:black;" align="center" width="60"|Performance
 |style="background:LightGrey; color:black"|Coating thickness
-|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+|style="background:WhiteSmoke; color:black" colspan="2"|
 *BARC DUV42S-6 60-90nm
 *Positive tone resist KRF M230Y 300-600nm
@@ Line 171: / Line 47: @@
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
 |style="background:LightGrey; color:black"|Spin speed
-|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+|style="background:WhiteSmoke; color:black" colspan="2"|
-- 5000 rpm
+&nbsp; 10 - 5000 rpm
 |-
 |style="background:LightGrey; color:black"|Spin acceleration
-|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+|style="background:WhiteSmoke; color:black" colspan="2"|
-- 10000 rpm/s
+&nbsp; 100 - 10000 rpm/s
 |-
 |style="background:LightGrey; color:black"|Hotplate temperature
-|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+|style="background:WhiteSmoke; color:black" colspan="2"|
 *175°C for BARC baking
 *130°C for positive tone resist soft baking and post exposure baking
@@ Line 187: / Line 63: @@
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
 |style="background:LightGrey; color:black"|Substrate size
-|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+|style="background:WhiteSmoke; color:black" colspan="2"|
 *100 mm wafers
 *150 mm wafers
@@ Line 193: / Line 69: @@
 |-
 | style="background:LightGrey; color:black"|Allowed materials
-|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+|style="background:WhiteSmoke; color:black" colspan="2"|
 *Any standard cleanroom material
 |-
 |style="background:LightGrey; color:black"|Batch
-|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+|style="background:WhiteSmoke; color:black" colspan="2"|
-- 25
+&nbsp; 1 - 25
 |-
 |}
 <br clear="all" />