Specific Process Knowledge/Lithography/Coaters/GammaDUV: Difference between revisions

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Created page with "==Spin coater: Süss stepper== 300x300px|right|thumb|The SÜSS Spinner-Stepper is placed in F-3 This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system. '''The user manual, quality control procedures and resul..."
 
Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,298 edits
 
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This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch  4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system.
This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch  4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system.
   
   
'''The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager:'''
The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager:
Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=279 LabManager]
 
Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=279 LabManager] - '''requires login'''


{{:Specific Process Knowledge/Lithography/Resist/DUVresist}}
{{:Specific Process Knowledge/Lithography/Resist/DUVresist}}


===Quality Control (QC)===
===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma DUV processing|Process information]]===
 
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for Spin coater: Süss Stepper - BARC DUV42S-6'''
|-
|
*[http://labmanager.dtu.dk/d4Show.php?id=5123&mach=279 The QC procedure for Spin coater: Süss Stepper]<br>
*[http://labmanager.dtu.dk/view_binary.php?fileId=4212 The newest QC data for Spin coater: Süss Stepper]
{| {{table}}
| align="center" |
{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:400px"
 
! QC Recipe:
! (1201) DCH 150mm BARC 65nm
|-
|Substrate size
|6"
|-
|Resist volume
|3 ml
|-
|Spin-off speed
|4700 rpm
|-
|Spin-off time
|30 s
|-
|Soft bake temperature
|175°C, contact
|-
|Soft bake time
|60 s
|-
|}
| align="center" valign="top"|
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px"
!QC limits
!Spin coater: Süss Stepper - BARC DUV42S-6
|-
|Nominal film thickness
|65 nm
|-
|Film thickness deviation from nominal
|<15%
|-
|Film thickness non-uniformity
|<5%
|-
|}
|-
|}
Spin-off speed will be adjusted if film thickness is outside the limit.
|}
 
 
 
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for Spin coater: Süss Stepper - BARC DUV42S-6'''
|-
|
*[http://labmanager.dtu.dk/d4Show.php?id=5123&mach=279 The QC procedure for Spin coater: Süss Stepper]<br>
*[http://labmanager.dtu.dk/view_binary.php?fileId=4212 The newest QC data for Spin coater: Süss Stepper]
{| {{table}}
| align="center" |
{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:400px"
 
! QC Recipe:
! (1202) DCH 100mm BARC 65nm
|-
|Substrate size
|4"
|-
|Resist volume
|1.6 ml
|-
|Spin-off speed
|3000 rpm
|-
|Spin-off time
|30 s
|-
|Soft bake temperature
|175°C, contact
|-
|Soft bake time
|60 s
|-
|}
| align="center" valign="top"|
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px"
!QC limits
!Spin coater: Süss Stepper - BARC DUV42S-6
|-
|Nominal film thickness
|65 nm
|-
|Film thickness deviation from nominal
|<15%
|-
|Film thickness non-uniformity
|<5%
|-
|}
|-
|}
Spin-off speed will be adjusted if film thickness is outside the limit.
|}
 


===Standard processes===
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#General_Process_Information|General Process Information]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Quality_Control_(QC)|Quality Control (QC)]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Standard_Processes|Standard Processes]]


BARC DUV42S-6 coating sequences:
===Equipment performance and process related parameters===
*'''(1201) DCH 150mm BARC 65nm''' Dispense 3ml@1000rpm; spin-off 30s@4700rpm; softbake 60s@175°C
*'''(1202) DCH 100mm BARC 65nm''' Dispense 1.6ml@1000rpm; spin-off 30s@3000rpm; softbake 60s@175°C
KRF M230Y coating sequences:
*'''(1301) DCH 150mm M230Y 360nm''' Dispense 3ml@1000rpm; spin-off 30s@2500rpm; softbake 90s@130°C
*'''(1302) DCH 100mm M230Y 360nm''' Dispense 1ml@1000rpm; spin-off 30s@2500rpm; softbake 90s@130°C
KRF M35G coating sequences:
*'''(1401) DCH 150mm M35G 750nm''' Dispense 3ml@1000rpm; spin-off 60s@5000rpm; softbake 90s@130°C
*'''(1402) DCH 100mm M35G 750nm''' Dispense 1ml@1000rpm; spin-off 60s@5000rpm; softbake 90s@130°C
*'''(1403) DCH 150mm M35G 1000nm''' Dispense 3ml@1000rpm; spin-off 60s@2630rpm; softbake 90s@130°C
*'''(1404) DCH 100mm M35G 1000nm''' Dispense 1ml@1000rpm; spin-off 60s@2630rpm; softbake 90s@130°C
*'''(1405) DCH 150mm M35G 1400nm''' Dispense 3ml@1000rpm; spin-off 60s@1310rpm; softbake 90s@130°C
*'''(1406) DCH 100mm M35G 1400nm''' Dispense 1ml@1000rpm; spin-off 60s@1310rpm; softbake 90s@130°C


== Equipment performance and process related parameters ==
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"  
 
{| border="2" cellspacing="0" cellpadding="2"  


!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
Line 146: Line 28:
|-
|-


!style="background:silver; color:black;" align="center" width="60"|Resist  
!style="background:silver; color:black; width="60"|Resist  
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
*BARC DUV42S-6
*BARC DUV42S-6
*Positive tone resist KRF M230Y
*Positive tone resist KRF M230Y
Line 156: Line 38:
!style="background:silver; color:black;" align="center" width="60"|Performance
!style="background:silver; color:black;" align="center" width="60"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
*BARC DUV42S-6 60-90nm
*BARC DUV42S-6 60-90nm
*Positive tone resist KRF M230Y 300-600nm
*Positive tone resist KRF M230Y 300-600nm
Line 165: Line 47:
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
10 - 5000 rpm
&nbsp; 10 - 5000 rpm
|-
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
100 - 10000 rpm/s
&nbsp; 100 - 10000 rpm/s
|-
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
*175°C for BARC baking
*175°C for BARC baking
*130°C for positive tone resist soft baking and post exposure baking
*130°C for positive tone resist soft baking and post exposure baking
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
*100 mm wafers
*100 mm wafers
*150 mm wafers
*150 mm wafers
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|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
*Any standard cleanroom material  
*Any standard cleanroom material  
|-
|-
|style="background:LightGrey; color:black"|Batch
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
1 - 25
&nbsp; 1 - 25
|-  
|-  
|}
|}
<br clear="all" />
<br clear="all" />

Latest revision as of 11:16, 3 February 2023

Spin coater: Süss stepper

The SÜSS Spinner-Stepper is placed in F-3

This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system.

The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager:

Equipment info in LabManager - requires login

DUV resist overview

The spinning process will be performed by the customer together with the Photolith group of Nanolab. In case you would like to do DUV lithography please contact Lithography team, who will consult you and run your wafers together with you.


Bottom Anti Reflection Coating (BARC):


Positive DUV resist for spin coating in 600-300nm thickness range:


Positive DUV resist for spin coating in 1600-800nm thickness range:


Negative DUV resist for spin coating in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range:

Process information

Equipment performance and process related parameters

Purpose
  • Spin coating and soft baking of BARC
  • Spin coating and soft baking of DUV resists
  • Post exposure baking
Resist
  • BARC DUV42S-6
  • Positive tone resist KRF M230Y
  • Positive tone resist KRF M35G
  • Negative tone resist UVN2300-0.8
Performance Coating thickness
  • BARC DUV42S-6 60-90nm
  • Positive tone resist KRF M230Y 300-600nm
  • Positive tone resist KRF M35G 800-1600nm
  • Negative tone resist UVN2300-0.8 200-1400nm
Process parameters Spin speed

  10 - 5000 rpm

Spin acceleration

  100 - 10000 rpm/s

Hotplate temperature
  • 175°C for BARC baking
  • 130°C for positive tone resist soft baking and post exposure baking
  • 100°C for negative tone resist soft baking and post exposure baking
Substrates Substrate size
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers (requires tool change)
Allowed materials
  • Any standard cleanroom material
Batch

  1 - 25


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