Specific Process Knowledge/Lithography/Coaters/RCD8: Difference between revisions
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==Spin Coater: RCD8== | ==Spin Coater: RCD8== | ||
[[Image:Spinner_RCD8_C-1.jpg|400px|thumb|Spin coater: RCD8 is located in | [[Image:Spinner_RCD8_C-1.jpg|400px|thumb|Spin coater: RCD8 is located in E-4]] | ||
Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. | Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. The media arm was disabled in 2024. | ||
However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes. | However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes. | ||
The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=360 LabManager] - '''requires login''' | |||
===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing|Process information]]=== | ===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing|Process information]]=== | ||
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Spin coating|Spin coating]] | *[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Spin coating|Spin coating]] | ||
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing# | *[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Dispense|Dispense]] | ||
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Recipes|Recipes and templates]] | *[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Recipes|Recipes and templates]] | ||
*[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Processing_results|Processing results]] | *[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing#Processing_results|Processing results]] | ||
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=== Equipment performance and process related parameters === | === Equipment performance and process related parameters === | ||
{| border=" | {|border="1" cellspacing="1" cellpadding="10" style="text-align:left;" | ||
!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
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*Spin coating of PGMEA based AZ resists | *Spin coating of PGMEA based AZ resists | ||
*Spin coating of wafers with structured backside | *Spin coating of wafers with structured backside | ||
*Edge bead removal | *(Edge bead removal) | ||
|- | |- | ||
!style="background:silver; color:black;" align="center" width="60"|Resist | !style="background:silver; color:black;" align="center" width="60"|Resist | ||
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|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* manual dispense | * manual dispense | ||
* automatic dispense from syringe | * <strike>automatic dispense from syringe</strike> | ||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | ||
|style="background:LightGrey; color:black"|Coating thickness | |style="background:LightGrey; color:black"|Coating thickness | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* SU-8 | * SU-8 resists: 0.1-200+ µm | ||
* AZ 5214E: 1.5-3 µm | * AZ 5214E: 1.5-3 µm | ||
* AZ 4562: 8-15 µm | * AZ 4562: 8-15 µm | ||
Latest revision as of 09:23, 3 November 2025
Spin Coater: RCD8
Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. The media arm was disabled in 2024.
However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes.
The user manual, user APV, and contact information can be found in LabManager - requires login
Process information
| Purpose |
| |
|---|---|---|
| Resist |
| |
| Performance | Coating thickness |
|
| Process parameters | Spin speed |
Vacuum chuck: 10 - 5000 rpm |
| Spin acceleration |
10 - 3000 rpm/s | |
| Substrates | Substrate size |
|
| Allowed materials |
All cleanroom materials ? | |
| Batch |
1 |