Specific Process Knowledge/Lithography/Coaters/GammaUV: Difference between revisions
| (9 intermediate revisions by one other user not shown) | |||
| Line 6: | Line 6: | ||
The system handles 4" and 6" wafers without size conversion, and can be set up to handle 2" or 8". | The system handles 4" and 6" wafers without size conversion, and can be set up to handle 2" or 8". | ||
The coater is equipped with 3 different | The coater is equipped with 3 different resist lines, as well as 1 syringe line: | ||
*AZ MiR 701 | *AZ MiR 701 | ||
*AZ nLOF 2020 | *AZ nLOF 2020 | ||
| Line 12: | Line 12: | ||
*Syringe, which can be used for various resists | *Syringe, which can be used for various resists | ||
The processes that are available on the system are developed by Nanolab. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and would as a starting point require batches in excess of 20 wafers. | The processes that are available on the system are developed by Nanolab. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and would as a starting point require batches in excess of 20 wafers. | ||
Link to information about [[Specific_Process_Knowledge/Pattern_Design#Helpful_information_for_chip_layout|coater chuck size and hotplate pin positions]]. | |||
'''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]''' | '''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]''' | ||
The user manual, quality control procedures and results, user APVs, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=359 LabManager] - '''requires login''' | |||
===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma UV processing|Process information]]=== | ===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma UV processing|Process information]]=== | ||
| Line 22: | Line 24: | ||
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#General_Process_Information|General Process Information]] | *[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#General_Process_Information|General Process Information]] | ||
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Quality_Control_(QC)|Quality Control (QC)]] | *[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Quality_Control_(QC)|Quality Control (QC)]] | ||
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Standard_Processes|Standard Processes | *[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Standard_Processes|Standard Processes]] | ||
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Syringe_processes|Syringe processes]] | *[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Syringe_processes|Syringe processes]] | ||
=== Equipment performance and process related parameters === | === Equipment performance and process related parameters === | ||
{| border=" | {|border="1" cellspacing="1" cellpadding="10" style="text-align:left;" | ||
!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
*HMDS priming | *HMDS priming | ||
*Spin coating of PGMEA based UV resists | *Spin coating of PGMEA based UV resists | ||
| Line 40: | Line 40: | ||
!style="background:silver; color:black;" align="center" width="60"|Resist | !style="background:silver; color:black;" align="center" width="60"|Resist | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
* AZ MiR 701 (29cps) | * AZ MiR 701 (29cps) | ||
* AZ nLOF 2020 | * AZ nLOF 2020 | ||
| Line 48: | Line 48: | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | ||
|style="background:LightGrey; color:black"|HMDS contact angle | |style="background:LightGrey; color:black"|HMDS contact angle | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
60 - 80° | 60 - 80° | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Coating thickness | |style="background:LightGrey; color:black"|Coating thickness | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
* AZ MiR 701: 1.5-4 µm | * AZ MiR 701: 1.5-4 µm | ||
* AZ nLOF 2020: 1.5-5 µm | * AZ nLOF 2020: 1.5-5 µm | ||
| Line 60: | Line 60: | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="5"|Process parameters | !style="background:silver; color:black" align="center" valign="center" rowspan="5"|Process parameters | ||
|style="background:LightGrey; color:black"|Priming temperature | |style="background:LightGrey; color:black"|Priming temperature | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
120 °C | 120 °C | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Spin speed | |style="background:LightGrey; color:black"|Spin speed | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
10 - 6000 rpm | 10 - 6000 rpm | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Spin acceleration | |style="background:LightGrey; color:black"|Spin acceleration | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
10 - 10000 rpm/s | 10 - 10000 rpm/s | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Hotplate temperature | |style="background:LightGrey; color:black"|Hotplate temperature | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
25 - 200 °C | 25 - 200 °C | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Cool plate temperature | |style="background:LightGrey; color:black"|Cool plate temperature | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
21 °C | 21 °C | ||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
* 50 mm wafers <sup>1)</sup> | * 50 mm wafers <sup>1)</sup> | ||
* 100 mm wafers | * 100 mm wafers | ||
| Line 88: | Line 88: | ||
|- | |- | ||
| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
Silicon and glass | Silicon and glass | ||
Resists and crystalbond are not allowed in the HMDS module | |||
|- | |- | ||
|style="background:LightGrey; color:black"|Batch | |style="background:LightGrey; color:black"|Batch | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
1 - 25 | 1 - 25 | ||
|- | |- | ||
|} | |} | ||
<sup>1)</sup> Requires tool change. | <sup>1)</sup> Requires tool change. | ||
<br clear="all" /> | <br clear="all" /> | ||