Specific Process Knowledge/Lithography/Coaters/GammaUV: Difference between revisions

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The system handles 4" and 6" wafers without size conversion, and can be set up to handle 2" or 8".
The system handles 4" and 6" wafers without size conversion, and can be set up to handle 2" or 8".


The coater is equipped with 3 different resists lines:  
The coater is equipped with 3 different resist lines, as well as 1 syringe line:
*AZ MiR 701
*AZ MiR 701
*AZ nLOF 2020
*AZ nLOF 2020
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'''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]'''
'''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]'''


'''The user manual, quality control procedures and results, user APVs, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=359 LabManager]'''
The user manual, quality control procedures and results, user APVs, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=359 LabManager] - '''requires login'''


===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma UV processing|Process information]]===
===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma UV processing|Process information]]===
Line 22: Line 22:
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#General_Process_Information|General Process Information]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#General_Process_Information|General Process Information]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Quality_Control_(QC)|Quality Control (QC)]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Quality_Control_(QC)|Quality Control (QC)]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Standard_Processes|Standard Processes]]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Standard_Processes|Standard Processes]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Syringe_processes|Syringe processes]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_UV_processing#Syringe_processes|Syringe processes]]


=== Equipment performance and process related parameters ===
=== Equipment performance and process related parameters ===


{| border="2" cellspacing="0" cellpadding="2"  
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"  
 
 
!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
*HMDS priming
*HMDS priming
*Spin coating of PGMEA based UV resists
*Spin coating of PGMEA based UV resists
Line 40: Line 38:
!style="background:silver; color:black;" align="center" width="60"|Resist  
!style="background:silver; color:black;" align="center" width="60"|Resist  
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
* AZ MiR 701 (29cps)
* AZ MiR 701 (29cps)
* AZ nLOF 2020
* AZ nLOF 2020
Line 48: Line 46:
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"|HMDS contact angle
|style="background:LightGrey; color:black"|HMDS contact angle
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
60 - 80°
  60 - 80°
|-
|-
|style="background:LightGrey; color:black"|Coating thickness
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
* AZ MiR 701: 1.5-4 µm
* AZ MiR 701: 1.5-4 µm
* AZ nLOF 2020: 1.5-5 µm
* AZ nLOF 2020: 1.5-5 µm
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!style="background:silver; color:black" align="center" valign="center" rowspan="5"|Process parameters
!style="background:silver; color:black" align="center" valign="center" rowspan="5"|Process parameters
|style="background:LightGrey; color:black"|Priming temperature
|style="background:LightGrey; color:black"|Priming temperature
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
120 °C
  120 °C
|-
|-
|style="background:LightGrey; color:black"|Spin speed
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
10 - 6000 rpm
  10 - 6000 rpm
|-
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
10 - 10000 rpm/s
  10 - 10000 rpm/s
|-
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
25 - 200 °C
  25 - 200 °C
|-
|-
|style="background:LightGrey; color:black"|Cool plate temperature
|style="background:LightGrey; color:black"|Cool plate temperature
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
21 °C
  21 °C
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
* 50 mm wafers <sup>1)</sup>
* 50 mm wafers <sup>1)</sup>
* 100 mm wafers
* 100 mm wafers
Line 88: Line 86:
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
Silicon and glass
Silicon and glass


No resist or crystalbond allowed in the HMDS module
Resists and crystalbond are not allowed in the HMDS module
|-
|-
|style="background:LightGrey; color:black"|Batch
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
1 - 25  
&nbsp; 1 - 25  
|-  
|-  
|}
|}


<sup>1)</sup> Requires tool change.
<sup>1)</sup> Requires tool change.
<br clear="all" />
<br clear="all" />

Latest revision as of 11:15, 3 February 2023

Spin Coater: Gamma UV

Spin Coater: Gamma UV in E-5

Spin Coater: Gamma UV was installed at DTU Nanolab in March 2015. It is a Gamma 2M cluster from Süss MicroTec with spin coating, HMDS vapour priming, and baking modules.

The system handles 4" and 6" wafers without size conversion, and can be set up to handle 2" or 8".

The coater is equipped with 3 different resist lines, as well as 1 syringe line:

  • AZ MiR 701
  • AZ nLOF 2020
  • AZ 5214E
  • Syringe, which can be used for various resists

The processes that are available on the system are developed by Nanolab. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and would as a starting point require batches in excess of 20 wafers.

Training video

The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager - requires login

Process information

Equipment performance and process related parameters

Purpose
  • HMDS priming
  • Spin coating of PGMEA based UV resists
  • Spin coating of E-beam resists 1)
  • Soft baking
Resist
  • AZ MiR 701 (29cps)
  • AZ nLOF 2020
  • AZ 5214E
  • 60cc syringe dispense
Performance HMDS contact angle

  60 - 80°

Coating thickness
  • AZ MiR 701: 1.5-4 µm
  • AZ nLOF 2020: 1.5-5 µm
  • AZ 5214E: 1.5-5 µm
  • AZ 4562: 5-15 µm
Process parameters Priming temperature

  120 °C

Spin speed

  10 - 6000 rpm

Spin acceleration

  10 - 10000 rpm/s

Hotplate temperature

  25 - 200 °C

Cool plate temperature

  21 °C

Substrates Substrate size
  • 50 mm wafers 1)
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers 1)
Allowed materials

Silicon and glass

Resists and crystalbond are not allowed in the HMDS module

Batch

  1 - 25

1) Requires tool change.

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