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Specific Process Knowledge/Lithography/Resist/DUVresist: Difference between revisions

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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Resist/DUVresist click here]'''
===DUV resist overview===
The spinning process will be performed by the customer together with the Photolith group of Nanolab. In case you would like to do DUV lithography, please contact Lithography team, who will consult you and run your wafers together with you.  


==DUV resist==
The spinning process will be performed by the customer together with the Photolith group of Nanolab. In case you would like to do DUV lithography please contact Lithography team, who will consult you and run your wafers together with you.


Information about resist can be found here:
'''Bottom Anti Reflection Coating (BARC):'''
*Manufacturers website: [http://www.brewerscience.com/products/arc/dry-etch-arc-coatings/248nm-products/duv42s DUV 42S-6]
*Datasheet: [https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Datasheet+DUV42S.pdf DUV42S-6] - '''requires login'''


*Bottom Anti Reflection Coating (BARC) [http://www.brewerscience.com/products/arc/dry-etch-arc-coatings/248nm-products/duv42s DUV 42S-6] [[Media:Datasheet_DUV42S.pdf |Datasheet DUV42S-6]].
 
*Positive DUV resist for spin coating in 600-300nm thickness range [[Media:M230Y_PSM_annular_130C_PEB.pdf|KRF M230Y]].
'''Positive DUV resist for spin coating in 600-300nm thickness range:'''
*Positive DUV resist for spin coating in 1600-800nm thickness range [[Media:M35G_Danchip_intro.pdf|KRF M35G]].
*Manufacturers website: [https://www.jsrmicro.be/semiconductor/lithography/jsr-krf-photoresists KrF M230Y]
*Negative DUV resist for spin coating in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range [[Media:UVN2300.pdf|UVN2300-0.8]].
*Datasheet: [https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=datasheet+M230Y.pdf KrF M230Y] - '''requires login'''
 
 
'''Positive DUV resist for spin coating in 1600-800nm thickness range:'''
*Manufacturers website: [https://www.jsrmicro.be/semiconductor/lithography/jsr-krf-photoresists KrF M35G]
*Datasheet: [https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=datasheet+M35G.pdf KrF M35G] - '''requires login'''
 
 
'''Negative DUV resist for spin coating in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range:'''
*Manufacturers website: [https://www.microresist.de/en/produkt/uvn-2300-series/ UVN2300-0.8]
*Datasheet: [https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=datasheet+UVN2300.pdf UVN2300-0.8] - '''requires login'''

Latest revision as of 12:31, 25 August 2025

DUV resist overview

The spinning process will be performed by the customer together with the Photolith group of Nanolab. In case you would like to do DUV lithography, please contact Lithography team, who will consult you and run your wafers together with you.


Bottom Anti Reflection Coating (BARC):


Positive DUV resist for spin coating in 600-300nm thickness range:


Positive DUV resist for spin coating in 1600-800nm thickness range:


Negative DUV resist for spin coating in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range: