Specific Process Knowledge/Etch/Wet Platinum Etch: Difference between revisions
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Etching of Platinum can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with [[Specific Process Knowledge/Etch/IBE/IBSD Ionfab 300|IBE]] by sputtering with Ar ions. | Etching of Platinum can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with [[Specific Process Knowledge/Etch/IBE/IBSD Ionfab 300|IBE]] by sputtering with Ar ions. |
Latest revision as of 10:07, 7 February 2023
Feedback to this page: click here
Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.
All links to Kemibrug (SDS) and Labmanager Including APV requires login.
All measurements on this page has been made by Nanolab staff.
Etching of Platinum can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with IBE by sputtering with Ar ions.
Wet Etching of Platinum
Platinum can be etched by the following wet etch:
- H2O : HCl : HNO3 (8 : 7 : 1) at 85 °C (note: etching starts at 70 C, 170nm etched in 5 min 70 C-85 C)* Nisoer July 2022
You have to be very careful when you work with this etch. It can generate nitrous gasses which are very toxic!!
At this moment we do not have any information on the etch rate. You should be aware that this wet etch will also etch gold and it is not possible to use any masking material, it is used as a stripper.
Wet etching of Platinum is done by making your own setup in a glass beaker in Fumehood 01 or 02 in Cleanroom D-3. Write content on the beaker and which metals has been etched with yellow permanent pen. You can see the APV here.
Platinum Etch data
Platinum wet etch | |
---|---|
General description |
Etch of Platinum |
Link to safety APV | see APV/Manual here. |
Chemical solution | HCl : HNO3 : H2O (7 : 1 : 8) |
Process temperature | 85 °C etches at 70 C* Nisoer July 2022 |
Possible masking materials | None |
Etch rate | 1-10 nm/min (Not tested. Mainly used as stripper) |
Batch size | 1-7 4" wafers at a time |
Size of substrate | Any that fits into a carrier that can go into the glass beaker |
Allowed materials | No restrictions.
Make a note on the beaker of which materials have been processed. |