Specific Process Knowledge/Lithography/EBeamLithography/FilePreparation/Pathlist: Difference between revisions
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=Path list= | |||
This is the full path list as available on the JEOL 9500 system. Please contact the EBL staff if you need a custom path defined on the tool. <div class="left" style="color:red; width:auto; margin-left:auto; margin-right:auto;">'''Users are NOT allowed to change the path definition file on the system.'''</div> | |||
INITIAL signifies subprograms carried out prior to pattern writing. CYCLIC determines subprograms carried out at the set interval during pattern writing. The first cycle is carried out right after INITIAL and hence before pattern writing. CYCLE defines the time between cyclic calibration, unit is minutes. The is two different behaviours toggled with the field '''F''' switch. Without the '''F''' switch cyclic calibration is only performed after pattern writing of the current chip is completed. If the pattern is a full wafer, i.e. defined as a (1,1) array in the JDF, no cyclic calibration will be done during pattern writing. With the '''F''' switch cyclic calibration will start at the end of the current writing field after the designated interval has passed. | |||
<pre> | |||
;;*** Mask Exposure Peformance Test *** | ;;*** Mask Exposure Peformance Test *** | ||
MASK00: INITIAL HEIMAP,CURRNT,INITBE,PDEFBE,DISTBE,PDEFBE,SUBDEFBE | MASK00: INITIAL HEIMAP,CURRNT,INITBE,PDEFBE,DISTBE,PDEFBE,SUBDEFBE | ||
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DRF5M: INITIAL CURRNT,HEIMAP | DRF5M: INITIAL CURRNT,HEIMAP | ||
CYCLIC CURRNT,DRIFT | |||
CYCLE 5M,F | |||
DTU5M: INITIAL HEIMAP,CURRNT,INITBE,PDEFBE,SUBDEFBE | DTU5M: INITIAL HEIMAP,CURRNT,INITBE,PDEFBE,SUBDEFBE | ||
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CYCLIC CURRNT | CYCLIC CURRNT | ||
CYCLE 30M | CYCLE 30M | ||
</pre> | |||