Specific Process Knowledge/Thin film deposition/Deposition of Ruthenium: Difference between revisions
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== Deposition of Ru == | == Deposition of Ru == | ||
Ruthenium can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment: | Ruthenium can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment: | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Comment | ! Comment | ||
|Please contact the thin film group before depositing Ru, even if Ru is in the machine. | |'''Please contact the thin film group before depositing Ru, even if Ru is in the machine.''' | ||
The current target material belongs to a specific customer. | The current target material belongs to a specific customer. | ||
Ru exhibits high stress as-deposited and has poor adhesion to Si with native oxide. | |||
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Latest revision as of 22:24, 7 July 2025
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Unless otherwise stated, this page is written by DTU Nanolab internal
Deposition of Ru
Ruthenium can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment:
| E-beam evaporation (Temescal) | Sputter deposition (Lesker) | |
|---|---|---|
| General description | E-beam deposition of Ru
(line-of-sight deposition) |
Sputter deposition of Ru
(not line-of-sight deposition) |
| Pre-clean | Ar ion bombardment | RF Ar clean |
| Layer thickness | 10Å to 1µm* | 10Å to 1µm** |
| Deposition rate | 0.5Å/s to 10Å/s | ~1Å/s |
| Batch size |
|
|
| Allowed materials |
|
|
| Comment | Please contact the thin film group before depositing Ru, even if Ru is in the machine.
The current target material belongs to a specific customer. Ru exhibits high stress as-deposited and has poor adhesion to Si with native oxide. |
** To deposit layers thicker than 600 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)
* To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)