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{{cc-nanolab}}
'''Feedback to this page''': '''[mailto:labadviser@Nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.Nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/characterisation/PL_Mapper click here]'''
'''Feedback to this page''': '''[mailto:labadviser@Nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.Nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/characterisation/PL_Mapper click here]'''
 
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==PhotoLuminescence Mapper RPM2000 ==
==PhotoLuminescence Mapper RPM2000 ==


[[Image:PL-mapper.jpg|500px|right|thumb|Positioned in the MOCVD room: F-1]]
[[Image:PL-mapper.jpg|500px|right|thumb|Positioned in the MOCVD room: F-1, {{photo1}}]]


Photoluminescence mapping is a non-contact, non-destructive technique for mapping out uniformity of alloy composition, material quality and defects in substrates and of III-V epiwafers. The Rapid Photoluminiscence Mapper (RPM) is equipped with 3 lasers for PL measurements and a white-light source to map out thickness and reflectance of eg layers, microcavities and VCSELs.
Photoluminescence mapping is a non-contact, non-destructive technique for mapping out uniformity of alloy composition, material quality and defects in substrates and of III-V epiwafers. The Rapid Photoluminiscence Mapper (RPM) is equipped with 3 lasers for PL measurements and a white-light source to map out thickness and reflectance of eg layers, microcavities and VCSELs.


[[Image:Wafer-bonding PL-mapper (LabAdviser) Jehem.jpg|500px|right|thumb|Map of two bonded silicon wafers. Red areas are voids between the wafers]]
[[Image:Wafer-bonding PL-mapper (LabAdviser) Jehem.jpg|500px|right|thumb|Map of two bonded silicon wafers. Red areas are voids between the wafers, Made by Jens Hemmingsen @ DTU Nanolab]]
It can also be used to map out voids after silicon wafer-bonding. This is done using the reflectance mapping and is using the fact that silicon is transparent for wavelengths above ~1000nm. A void will therefor change the reflectance in that wavelength range. See datasheet below (Thanks to Jens Hemmingsen for the data).
It can also be used to map out voids after silicon wafer-bonding. This is done using the reflectance mapping and is using the fact that silicon is transparent for wavelengths above ~1000nm. A void will therefor change the reflectance in that wavelength range. See datasheet below (Thanks to Jens Hemmingsen for the data).


'''The user manual and contact information can be found in LabManager:'''
The user manual and contact information can be found in [http://www.labmanager.dtu.dk/function.php?module=Machine&view=view&mach=152 '''LabManager'''].
 
[http://www.labmanager.dtu.dk/function.php?module=Machine&view=view&mach=152 PL mapper]


{| border="2" cellspacing="0" cellpadding="10"  
{| border="2" cellspacing="0" cellpadding="10"  
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|style="background:LightGrey; color:black"|RPM viewer
|style="background:LightGrey; color:black"|RPM viewer
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Software (free) to view and re-analyse the maps and spectra can be found on Labmanager.
*Only on the local PC at the system
*Direct link to file download [http://labmanager.dtu.dk/view_binary.php?fileId=832 RPM2000 analysis software].
*The software will request you to get a (free) license key from Nanometrics.
|}
|}
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