Specific Process Knowledge/Etch/DRIE-Pegasus/Etch 3 dimensional silicon microstructures

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• This work was done by Henri Jansen and Bingdong Chang in 2017;

• This page was last edited by Bingdong Chang 24 October 2017.

By combining anisotropic Bosch process and isotropic etch process, 3 dimensional structures can be fabricated using DRIE-Pegasus, below is an example to show how 3D "sausage-chain-like" micropillars can be achieved. The patterns were defined with DUV lithography (1µm diameter structures with 2µm pitch size), the resist used was 750nm KRF M230Y positive DUV resist.

• Recipe to achieve sausage-chain-like micropillars
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• SEM images of 3D sausage-chain-like micropillars
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Using the similar methods, other types of 3D microstructures can be fabricated, below are some silicon structures etched with UV resist as a mask, the lithography step was performed with Aligner Maskless, with 1.5µm thick AZ nlof negative resist or 1.5µm AZ 5214 positive resist.

• SEM images of other kinds of 3D silicon microstructures
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For more details, please contact Henri Jansen (henrija@dtu.dk) or Bingdong Chang (bincha@dtu.dk)