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The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.  
The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.  
''The Cammax EDB80 Die bonder is currently (only temporary) taken out of service during the PolyFabLab construction.''


The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.
The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.
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== Process information ==
== Process information ==


*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding|Au-Sn eutectic die bonding]]
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Latest revision as of 15:52, 3 July 2025

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The Die-bonder Cammax EDB-80 is placed in the Packlab in building 347, 1st floor.
Heating Chuck on the Die-bonder

Die bonder (eutectic metal soldering)

The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.

The Cammax EDB80 Die bonder is currently (only temporary) taken out of service during the PolyFabLab construction.

The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.

The user manuals, user APVs, technical information and contact information can be found in LabManager:

Die Bonder in LabManager

Process information

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Equipment performance and process related parameters

Equipment Die bonder
Purpose
  • Fine placement of dies
  • Eutectic metal soldering
Performance
  • Low thermal resistance
  • Always conducting
Substrates Allowed materials
  • Should be able to withstand the soldering temperature
  • Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)


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