Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions
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The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate. | The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate. | ||
[[Image:section under construction.jpg|70px]] ''Will be temporary taken out of service during the PolyFabLab construction.'' | |||
The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier. | The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier. | ||
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | ||
|style="background:WhiteSmoke; color:black"|<b>Die bonder</b> | |style="background:WhiteSmoke; color:black"|<b>Die bonder</b> | ||
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!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
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*Fine placement of dies | *Fine placement of dies | ||
*Eutectic metal soldering | *Eutectic metal soldering | ||
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!style="background:silver; color:black;" align="center" width="60"|Performance | !style="background:silver; color:black;" align="center" width="60"|Performance | ||
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*Low thermal resistance | *Low thermal resistance | ||
*Always conducting | *Always conducting | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
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*Should be able to withstand the soldering temperature | *Should be able to withstand the soldering temperature | ||
*Typical materials are: Alumina (Al2O3), AluminumNitride (AlN) | *Typical materials are: Alumina (Al2O3), AluminumNitride (AlN) | ||
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Latest revision as of 14:59, 6 March 2023
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Die bonder (eutectic metal soldering)
The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.
Will be temporary taken out of service during the PolyFabLab construction.
The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.
The user manuals, user APVs, technical information and contact information can be found in LabManager:
Process information
| Equipment | Die bonder | |
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| Purpose |
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| Performance |
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| Substrates | Allowed materials |
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