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==Etching of Chromium==
'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
[[Image:fumehoodetch-chrom.jpg|300x300px|thumb|Fume hood: positioned in cleanroom 2. <br />Wet Etch of Chromium can take place in a beaker in this fume hood]]
Etching of chromium is done wet at Danchip making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. We have two solution for this:


# HNO<math>_3</math>:H<math>_2</math>O:cerisulphate  - 90ml:1200ml:15g - standard at Danchip
'''All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.'''
# Commercial chromium etch


Etch rate are depending on the level of oxidation of the metal.
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Chromium click here]'''
<!--Page reviewed by jmli 1/8-2016  -->
<!--Page reviewed by jmli 9/8-2022  -->


====How to mix the Chromium etch 1:====
#Take a beaker and add 15g of cerium sulphate.
#Add a little water while stirring - make sure all lumps are gone.
#Add water until 600 ml - keep stirring (use magnetic stirring)
#Add 90 ml HNO<math>_3</math>
#When the cerium sulphate is completely dissolved (Clear liquid) you can add the other 600 ml of wafer.


==Etching of Chromium==


Etching of chromium can be done either by wet etch, dry etch or by sputtering with ions.
*[[Specific Process Knowledge/Etch/Wet Chromium Etch|Etching of Cr by wet etch]]
*[[Specific Process Knowledge/Etch/ICP Metal Etcher/Chromium|Etching of Cr by ICP metal]]
*[[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300|Sputtering of Cr]]
<br clear="all" />
<br clear="all" />


===Overview of the data for the chromium etches===
==Comparison of Chromium Etch Methods==
{| border="1" cellspacing="0" cellpadding="4"  
 
!
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
! Chromium etch 1
|-
! Chromium etch 2
 
|-  
| '''General description'''
|
Etch of chromium
|
Etch of chromium
|-
|-
| '''Chemical solution'''
|-style="background:silver; color:black"
|HNO<math>_3</math>:H<math>_2</math>O:cerisulphate  - 90ml:1200ml:15g
!
|.
![[Specific Process Knowledge/Etch/Wet Chromium Etch|Cr wet etch]]
![[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher|ICP metal]]
![[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300|IBE (Ionfab300+)]]
|-
|-
| '''Process temperature'''
|Room temperature


|.
|-
|-style="background:WhiteSmoke; color:black"
!Generel description
|Wet etch of Cr premixed (Chrome etch 18)
|Dry plasma etch of Cr
|Sputtering of Cr - pure physical etch
|-


|-
|-
 
|-style="background:LightGrey; color:black"
| '''Possible masking materials'''
!Etch rate range
|
|
Photoresist (1.5 µm AZ5214E)
*~150nm/min at room temperature
|
|
.
*~14 nm/min (depending on features size and etch load)
|
*~30nm/min (not tested yet)
|-
 
|-
|-
|'''Etch rate'''
|-style="background:WhiteSmoke; color:black"
!Etch profile
|
|
~40-100 nm/min
*Isotropic
|
|
.
*Anisotropic (vertical sidewalls)
|
*Anisotropic (angles sidewalls, typical around 70 dg)
|-
 
 
|-
|-
|'''Batch size'''
|-style="background:LightGrey; color:black"
!Substrate size
|
|
1-25 wafers at a time
*Any size and number that can go inside the beaker in use
|
|
.
*smaller pieces on a carrier wafer
*<nowiki>#</nowiki>1 100mm wafers (when set up to 100mm wafers)
*<nowiki>#</nowiki>1 150mm wafers (when set up to 150mm wafers)
|
Smaller pieces glued to carrier wafer
*<nowiki>#</nowiki>1 50mm wafer
*<nowiki>#</nowiki>1 100mm wafer
*<nowiki>#</nowiki>1 150mm wafer
*<nowiki>#</nowiki>1 200mm wafer
|-
|-
|'''Size of substrate'''
 
|-
|-style="background:WhiteSmoke; color:black"
!Allowed materials
|
|
4" wafers
No restrictions cross contamination wise as long as you use the right beaker and make sure that they are safe to enter in the chemicals
|
|
.
*Silicon
|-
*Quartz/fused silica
|'''Allowed materials'''
*Photoresist/e-beam resist
*PolySilicon,
*Silicon oxide
*Silicon (oxy)nitride
*Aluminium
*Titanium
*Chromium
|
|
No restrictions.
*Silicon
Make a note on the bottle of which materials have been processed.
*Silicon oxides
|
*Silicon nitrides
.
*Metals from the +list
*Metals from the -list
*Alloys from the above list
*Stainless steel
*Glass
*III-V materials
*Resists
*Polymers
*Capton tape
|-
|-
|}
|}
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