Specific Process Knowledge/Thin film deposition: Difference between revisions

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<center><span style="background:PaleGreen">3rd Level - Material/Method</span></center>
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition click here]'''
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition click here]'''
<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>




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{| {{table}}
{| {{table}}
| align="left" valign="top"  style="background:LightGray"|''' Semiconductors'''
| align="left" valign="top"  style="background:LightGray"|''' Semiconductors'''
| align="left" valign="top" style="background:#DCDCDC;"|''' Oxides'''
| align="left" valign="top" style="background:#DCDCDC"|''' Oxides'''
| align="left" valign="top" style="background:LightGray"|''' Nitrides'''
| align="left" valign="top" style="background:LightGray"|''' Nitrides'''
| align="left" valign="top" style="background:#DCDCDC;"|''' Metals'''
| align="left" valign="top" style="background:#DCDCDC"|''' Carbon and Carbides'''
| align="left" valign="top" style="background:LightGray"|''' Alloys'''
| align="left" valign="top" style="background:LightGray"|''' Metals'''
| align="left" valign="top" style="background:#DCDCDC;"|''' Transparent conductive oxides'''
| align="left" valign="top" style="background:#DCDCDC"|''' Alloys'''
| align="left" valign="top" style="background:LightGray"|''' Polymers'''
| align="left" valign="top" style="background:LightGray"|''' Transparent conductive oxides'''
| align="left" valign="top" style="background:#DCDCDC"|''' Polymers'''
| align="left" valign="top" style="background:LightGray"|''' Multilayers'''
|-valign="top"
|-valign="top"


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[[/Sputter deposition of oxides and other compounds|Chromium Oxide (Cr<sub>2</sub>O<sub>3</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Chromium Oxide (Cr<sub>2</sub>O<sub>3</sub>)]]<br/>
[[/Deposition of Hafnium Oxide|Hafnium Oxide (HfO<sub>2</sub>)]]<br/>
[[/Deposition of Hafnium Oxide|Hafnium Oxide (HfO<sub>2</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Magnesium Oxide (MgO)]]<br/>
[[/Sputter deposition of oxides and other compounds|Nickel Oxide (NiO)]]<br/>
[[/Deposition of Silicon Oxide|Silicon Oxide (SiO<sub>2</sub>)]]<br/>
[[/Deposition of Silicon Oxide|Silicon Oxide (SiO<sub>2</sub>)]]<br/>
[[/Deposition of Titanium Oxide|Titanium Oxide (TiO<sub>2</sub>)]]<br/>
[[/Deposition of Titanium Oxide|Titanium Oxide (TiO<sub>2</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Tantalum Oxide (Ta<sub>2</sub>O<sub>5</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Tantalum Oxide (Ta<sub>2</sub>O<sub>5</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Vanadium Oxide (VO<sub>x</sub>)]]<br/>
[[/Deposition of ZnO|Zinc Oxide (ZnO)]]<br/>
[[/Deposition of ZnO|Zinc Oxide (ZnO)]]<br/>


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[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/>
[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/>
[[/Deposition of Titanium Nitride|Titanium Nitride]] - ''conductive ceramics'' <br/>
[[/Deposition of Titanium Nitride|Titanium Nitride]] - ''conductive ceramics'' <br/>
[[/Deposition of Niobium Titanium Nitride| Niobium Titanium Nitride]] - ''superconductors''<br/>
[[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>
[[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>
[[/Deposition of Scandium Nitride| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>




|style="background: #DCDCDC"|
|style="background: #DCDCDC"|
[[/Deposition of Carbon|Carbon]] <br/>
<!-- [[/Deposition of Titanium Carbide|Titanium Carbide (TiC)]]<br/> -->
[[/Deposition of Silicon Carbide|Silicon Carbide (SiC)]]<br/>
[[/Sputter deposition of metals and alloys|Tantalum carbide (TaC<sub>x</sub>)]]<br/>
|style="background: LightGray"|
[[/Deposition of Aluminium|Aluminium]] <br/>
[[/Deposition of Aluminium|Aluminium]] <br/>
[[/Deposition of Chromium|Chromium]]<br/>
[[/Deposition of Chromium|Chromium]]<br/>
[[/Sputter deposition of metals and alloys|Cobalt]]<br/>
[[/Deposition of Copper|Copper]]<br/>
[[/Deposition of Copper|Copper]]<br/>
[[/Deposition of Gold|Gold]]<br/>
[[/Deposition of Gold|Gold]]<br/>
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[[/Deposition of Tungsten|Tungsten]]<br/>
[[/Deposition of Tungsten|Tungsten]]<br/>
[[/Deposition of Zinc|Zinc]]<br/>
[[/Deposition of Zinc|Zinc]]<br/>
[[/Deposition of Scandium|Scandium]]<br/>






|style="background: LightGray"|
|style="background: #DCDCDC"|
[[/Sputter deposition of metals and alloys|AlCu]]<br/>
[[/Sputter deposition of metals and alloys|AlCu]]<br/>
[[/Sputter deposition of metals and alloys|CoFe]]<br/>
[[/Sputter deposition of metals and alloys|CuTi]]<br/>
[[/Sputter deposition of metals and alloys|CuTi]]<br/>
[[/Sputter deposition of metals and alloys|FeMn]]<br/>
[[/Sputter deposition of metals and alloys|FeMn]]<br/>
[[/Sputter deposition of metals and alloys|MnIr]]<br/>
[[/Sputter deposition of metals and alloys|MnIr]]<br/>
[[/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process information|NbTi]] <br/>
[[/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process information|NbTi]] <br/>
[[/Sputter deposition of metals and alloys|NiCo]]<br/>
[[/Deposition of NiFe|NiFe]]<br/>
[[/Deposition of NiFe|NiFe]]<br/>
[[/Deposition of NiV|NiV]] alloy <br/>
[[/Deposition of NiV|NiV]] alloy <br/>
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[[/Sputter deposition of oxides and other compounds|YSZ]] (Yttrium stabilized zirconia)<br/>
[[/Sputter deposition of oxides and other compounds|YSZ]] (Yttrium stabilized zirconia)<br/>
[[/Gadolinium Cerium Oxide|Gd<sub>0.2</sub>Ce<sub>0.8</sub>O<sub>2</sub> (GCO)]]


|style="background: #DCDCDC"|
|style="background: LightGray"|
[[/Deposition of ITO|ITO (Tin doped Indium Oxide)]]<br/>
[[/Deposition of ITO|ITO (Tin doped Indium Oxide)]]<br/>
[[/Deposition of AZO |AZO (Aluminum doped Zinc Oxide)]]<br/>
[[/Deposition of AZO |AZO (Aluminum doped Zinc Oxide)]]<br/>


|style="background: LightGray"|
|style="background: #DCDCDC"|
[[Specific Process Knowledge/Lithography/SU-8|SU-8]]<br/>
[[Specific Process Knowledge/Lithography/SU-8|SU-8]]<br/>
[[Specific Process Knowledge/Thin film deposition/MVD#Processing on the MVD| Antistiction coating]] <br/>
[[Specific Process Knowledge/Thin film deposition/MVD#Processing on the MVD| Antistiction coating]] <br/>
Topas <br/>
Topas <br/>
PMMA
PMMA
|style="background: LightGray"|
[[/Deposition of CrSi|CrSi bilayer]] <br/>
|-
|-
|}
|}
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{| {{table}}
{| {{table}}
| align="left" valign="top"  style="background:LightGray"|''' PVD'''
| align="left" valign="top"  style="background:LightGray"|''' PVD - Physical vapor deposition'''
| align="left" valign="top" style="background:#DCDCDC;"|''' LPCVD'''
| align="left" valign="top" style="background:#DCDCDC;"|''' LPCVD - low pressure chemical vapor deposition'''
| align="left" valign="top" style="background:LightGray"|''' PECVD'''
| align="left" valign="top" style="background:LightGray"|''' PECVD - plasma enhanced chemical vapor deposition'''
| align="left" valign="top" style="background:#DCDCDC;"|''' ALD'''
| align="left" valign="top" style="background:#DCDCDC;"|''' ALD - atomic layer deposition'''
| align="left" valign="top" style="background:LightGray"|''' Coaters'''
| align="left" valign="top" style="background:LightGray"|''' Coaters - for polymers'''
| align="left" valign="top" style="background:#DCDCDC;"|''' Others'''
| align="left" valign="top" style="background:#DCDCDC;"|''' Others'''


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*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator''
*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator''
*[[/thermalevaporator|Thermal evaporator]]  
*[[/thermalevaporator|Thermal evaporator]]  
*[[/Temescal|E Beam Evaporator (Temescal)]]
*[[/Temescal|E-Beam Evaporator (Temescal)]]
*[[/Physimeca|Physimeca]] - ''E-beam evaporator''
*[[/10-pocket e-beam evaporator|E-Beam Evaporator (10 pockets)]]
*[[Specific Process Knowledge/Etch/IBE&frasl;IBSD Ionfab 300|IBE/IBSD Ionfab 300]] - ''Sputter deposition of high quality optical layers and milling/etching''
*[[/Sputter coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] - ''Gold sputtering system''
*[[/Sputter coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] - ''Gold sputtering system''
*[[/Sputter coater#Sputter_coater_04_(Agar Scientific)|Sputter coater 04]] - ''Gold sputtering system''
*[[/Sputter coater#Sputter_coater_04_(Agar Scientific)|Sputter coater 04]] - ''Gold sputtering system''
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*[[/III-V Dielectric evaporator|III-V Dielectric evaporator]] -<span style="color:Red"> (Decommissioned</span>) ''E-beam evaporation tool''  
*[[/III-V Dielectric evaporator|III-V Dielectric evaporator]] -<span style="color:Red"> (Decommissioned</span>) ''E-beam evaporation tool''  
*[[/Alcatel|Alcatel]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and sputter tool''
*[[/Alcatel|Alcatel]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and sputter tool''
*[[/Physimeca|Physimeca]] - ''E-beam evaporator''
*[[/Multisource_PVD|PVD co-sputter/evaporation]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and multiple wafer tool'' -->
*[[/Multisource_PVD|PVD co-sputter/evaporation]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and multiple wafer tool'' -->


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|style="background: LightGray"|
|style="background: LightGray"|
*[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition''
*[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition''
*[[/Black Magic PECVD|Black Magic PECVD]] - ''Black Magic PECVD (Carbon)''
<!--*[[/DiamondCVD|Seki Diamond CVD]] - ''Microwave Plasma CVD for diamond Growth''-->
*[[/DiamondCVD|Seki Diamond CVD]] - ''Microwave Plasma CVD for diamond Growth''
|style="background: #DCDCDC"|
|style="background: #DCDCDC"|
*[[/ALD Picosun R200|ALD1]] - Atomic Layer Deposition (thermal)
*[[/ALD Picosun R200|ALD1]] - Atomic Layer Deposition (thermal)
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|style="background: #DCDCDC"|
|style="background: #DCDCDC"|
*[[/MVD|MVD]] - ''Molecular Vapor Deposition''
*[[/MVD|MVD]] - ''Molecular Vapor Deposition''
*[[/Electroplating-Ni|Electroplating-Ni]] - ''Electrochemical deposition of nickel''
*Electroplating of Ni, Cu, Au, etc. - ''Ask in the department of Mechanical Engineering''
*[[/Electroplating-Cu|Electroplating-Cu]] - ''Electrochemical deposition of copper''
*MOCVD - Epitaxial growth of InP, GaAs and other III-V materials - ''Ask DTU Electro if you are interested: [mailto:esem@dtu.dk Elizaveta Semenova] or [mailto:kryv@dtu.dk Kresten Yvind]''
*MOCVD - Epitaxial growth - ''Ask the department of photonics if you are interested: [mailto:esem@fotonik.dtu.dk Elizaveta Semenova] or [mailto:kryv@fotonok.dtu.dk Kresten Yvind]''
|-
|-
|}
|}

Latest revision as of 09:43, 29 August 2024

Feedback to this page: click here

Unless otherwise stated, this page is written by DTU Nanolab internal


Choose material to deposit

Semiconductors Oxides Nitrides Carbon and Carbides Metals Alloys Transparent conductive oxides Polymers Multilayers

Silicon
Germanium

Aluminium Oxide (Al2O3)
Barium titanate (BaTiO3)
Chromium Oxide (Cr2O3)
Hafnium Oxide (HfO2)
Magnesium Oxide (MgO)
Nickel Oxide (NiO)
Silicon Oxide (SiO2)
Titanium Oxide (TiO2)
Tantalum Oxide (Ta2O5)
Vanadium Oxide (VOx)
Zinc Oxide (ZnO)

Silicon Nitride - and oxynitride
Titanium Nitride - conductive ceramics
Niobium Titanium Nitride - superconductors
Aluminum Nitride (AlxNy)
Scandium Nitride (ScxNy)

Carbon
Silicon Carbide (SiC)
Tantalum carbide (TaCx)

Aluminium
Chromium
Copper
Gold
Iron
Magnesium
Molybdenum
Nickel
Niobium
Palladium
Platinum
Ruthenium
Silver
Tantalum
Tin
Titanium
Tungsten
Zinc
Scandium

AlCu
CuTi
FeMn
MnIr
NbTi
NiFe
NiV alloy
TiW alloy (10%/90% by weight)

And an electroceramic:

YSZ (Yttrium stabilized zirconia)
Gd0.2Ce0.8O2 (GCO)

ITO (Tin doped Indium Oxide)
AZO (Aluminum doped Zinc Oxide)

SU-8
Antistiction coating
Topas
PMMA

CrSi bilayer

Oh no! My material is not on the list! Please contact the Thin Film group if you would like to inquire about a material that is not mentioned here.

Choose deposition equipment

PVD - Physical vapor deposition LPCVD - low pressure chemical vapor deposition PECVD - plasma enhanced chemical vapor deposition ALD - atomic layer deposition Coaters - for polymers Others



  • PECVD - Plasma Enhanced Chemical Vapor deposition
  • ALD1 - Atomic Layer Deposition (thermal)
  • ALD2 (PEALD) - Atomic Layer Deposition (thermal and plasma enhanced)

See the Lithography/Coaters page for coating polymers

  • MVD - Molecular Vapor Deposition
  • Electroplating of Ni, Cu, Au, etc. - Ask in the department of Mechanical Engineering
  • MOCVD - Epitaxial growth of InP, GaAs and other III-V materials - Ask DTU Electro if you are interested: Elizaveta Semenova or Kresten Yvind
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