Specific Process Knowledge/Wafer cleaning/Post CMP Cleaner: Difference between revisions

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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/Post_CMP_Cleaner click here]'''  
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/Post_CMP_Cleaner click here]'''  


'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''


'''All links to Labmanager requires login.'''




== Post CMP Cleaner) ==
== Post CMP Cleaner) ==


[[image:Cmp_picture.jpg|400px|right|thumb|The Post CMP CLeaner in cleanroom A-5]]
[[image:post cmp cleaner.jpg|400px|right|thumb|The Post CMP CLeaner in cleanroom A-5]]


The post CMP Cleaner is designed for removing slurry residues from polishing wafers. After the Post CMP cleaner is the recommended cleaning tool after using the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Polisher_CMP Polisher CMP]'''.
The post CMP Cleaner is designed for removing slurry residues from polishing wafers. The Post CMP cleaner is the recommended cleaning tool after using the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Polisher_CMP Polisher CMP]'''.




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<!-- give the link to the equipment info page in LabManager: -->
<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=431 The Post CMP Cleaner in LabManager]
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=431 The Post CMP Cleaner in LabManager]
==Equipment performance and process related parameters==
{| border="2" cellspacing="0" cellpadding="2"
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>Post CMP Cleaner</b>
<!-- |style="background:WhiteSmoke; color:black"|<b>Equipment 2</b> -->
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
Cleaning of
|style="background:WhiteSmoke; color:black"|
*Samples from the CMP
<!-- |style="background:WhiteSmoke; color:black"|
*Purpose 1
*Purpose 2
*Purpose 3 -->
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameter range
|-
|style="background:LightGrey; color:black"|Mechanical Cleaning
|style="background:WhiteSmoke; color:black"|
*Brush Cleaning
|-
|style="background:LightGrey; color:black"|Power
|style="background:WhiteSmoke; color:black"|
*Megasonic Power from 0-40 W (in water)
|-
|style="background:LightGrey; color:black"|Arm sweep
|style="background:WhiteSmoke; color:black"|
*4" and 6" (20x20mm and 2" run with a 4" sweep)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Sample size
|style="background:WhiteSmoke; color:black"|
*<nowiki></nowiki> one 20x20mm piece
*one 50 mm wafer
*one 2" wafer
*one 100 mm wafer
*one 150 mm wafer
<!-- |style="background:WhiteSmoke; color:black"|
*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers -->
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*Silicon
*Polysilicon
*Silicon Oxide
*Glass/Quartz
<!-- |style="background:WhiteSmoke; color:black"|
*Allowed material 1
*Allowed material 2
*Allowed material 3 -->
|-
|}
<br clear="all" />

Latest revision as of 12:57, 13 February 2023

Feedback to this page: click here

Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

All links to Labmanager requires login.


Post CMP Cleaner)

The Post CMP CLeaner in cleanroom A-5

The post CMP Cleaner is designed for removing slurry residues from polishing wafers. The Post CMP cleaner is the recommended cleaning tool after using the Polisher CMP.


The user manual, user APV, technical information and contact information can be found in LabManager:

The Post CMP Cleaner in LabManager

Equipment performance and process related parameters

Equipment Post CMP Cleaner
Purpose

Cleaning of

  • Samples from the CMP
Process parameter range
Mechanical Cleaning
  • Brush Cleaning
Power
  • Megasonic Power from 0-40 W (in water)
Arm sweep
  • 4" and 6" (20x20mm and 2" run with a 4" sweep)
Substrates Sample size
  • one 20x20mm piece
  • one 50 mm wafer
  • one 2" wafer
  • one 100 mm wafer
  • one 150 mm wafer
Allowed materials
  • Silicon
  • Polysilicon
  • Silicon Oxide
  • Glass/Quartz


Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Wafer_cleaning/Post_CMP_Cleaner&oldid=44628"