Specific Process Knowledge/Back-end processing/LatticeAxe: Difference between revisions

From LabAdviser
Rkch (talk | contribs)
No edit summary
Sifkle (talk | contribs)
No edit summary
 
(9 intermediate revisions by 2 users not shown)
Line 1: Line 1:
The Cleaver: Lattice Axe is designed for cleaving wafers into smaller pieces. The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: lattice axe should always be placed inside Fume hood 5.
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/LatticeAxe click here]'''
 
'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
 
== The Cleaver: LatticeAxe ==
 
The Cleaver: LatticeAxe is designed for cleaving wafers into smaller pieces without leaving any particles on the sample. It works by making a small mark in the side of the sample that is then used as a start point for the cleaving.
 
The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: lattice axe should always be placed inside Fume hood 5.
 
[[File:LatticeAxe placer prøve.JPG|400px]]


'''Approved Materials''':
'''Approved Materials''':


<nowiki>Si
*Si
Quartz
*Quartz
Pyrex (Borofloat 33)
*Pyrex (Borofloat 33)
GaAs
*GaAs
InP
*InP
Sapphire</nowiki>
*Sapphire
 
The LatticeAxe can cleave samples from 100mm down to 10mm. In some cases it can even be used on larger samples please contact wetchemistry group for more information
 
DTU-Nanolab has 3 different types of Cleavers see the Labadviser pages for the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/FlexScribe FlexScribe]''' and the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/FlipScribe FlipScribe]''' for more information.

Latest revision as of 07:43, 1 February 2023

Feedback to this page: click here

Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

The Cleaver: LatticeAxe

The Cleaver: LatticeAxe is designed for cleaving wafers into smaller pieces without leaving any particles on the sample. It works by making a small mark in the side of the sample that is then used as a start point for the cleaving.

The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: lattice axe should always be placed inside Fume hood 5.

Approved Materials:

  • Si
  • Quartz
  • Pyrex (Borofloat 33)
  • GaAs
  • InP
  • Sapphire

The LatticeAxe can cleave samples from 100mm down to 10mm. In some cases it can even be used on larger samples please contact wetchemistry group for more information

DTU-Nanolab has 3 different types of Cleavers see the Labadviser pages for the FlexScribe and the FlipScribe for more information.