Specific Process Knowledge/Back-end processing/LatticeAxe: Difference between revisions

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-==Equipment performance and process related parameters==
+'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/LatticeAxe click here]'''
-{| border="2" cellspacing="0" cellpadding="2"
+'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
-!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
+== The Cleaver: LatticeAxe ==
-|style="background:WhiteSmoke; color:black"|<b>Wafer scriber</b>
-|-
-!style="background:silver; color:black;" align="center" width="60"|Purpose
-|style="background:LightGrey; color:black"|Cleaving samples in smaller pieces
-|style="background:WhiteSmoke; color:black"|
-|-
+The Cleaver: LatticeAxe is designed for cleaving wafers into smaller pieces without leaving any particles on the sample. It works by making a small mark in the side of the sample that is then used as a start point for the cleaving.
-!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
-|style="background:LightGrey; color:black"|Scribe lines
-|style="background:WhiteSmoke; color:black"| Lines can be made perpendicular to each other by turning chuck 90°
-|-
+The equipment is placed in the left drawer underneath fume hood 5: Special purposes. When operated the the Cleaver: lattice axe should always be placed inside Fume hood 5.
-!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
-|style="background:LightGrey; color:black"|Wafer thickness
-|style="background:WhiteSmoke; color:black"| Adjustable by increasing or decreasing the load of the diamond pen
-|-
+[[File:LatticeAxe placer prøve.JPG|400px]]
-|style="background:LightGrey; color:black"|Distance between scribe lines
-|style="background:WhiteSmoke; color:black"| Approx. 5 mm
-|-
+'''Approved Materials''':
-!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
-|style="background:LightGrey; color:black"| Size of Substrate
-|style="background:WhiteSmoke; color:black"| Up to 100 mm wafers
-|-
+*Si
-|style="background:LightGrey; color:black"|Allowed materials
+*Quartz
-|style="background:WhiteSmoke; color:black"| All but only Si where the scribe lines are made
+*Pyrex (Borofloat 33)
+*GaAs
+*InP
+*Sapphire
+The LatticeAxe can cleave samples from 100mm down to 10mm. In some cases it can even be used on larger samples please contact wetchemistry group for more information
-|-
+DTU-Nanolab has 3 different types of Cleavers see the Labadviser pages for the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/FlexScribe FlexScribe]''' and the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/FlipScribe FlipScribe]''' for more information.
-|}
-<br clear="all" />