Specific Process Knowledge/Back-end processing/LatticeAxe: Difference between revisions

Latest revision as of 07:43, 1 February 2023

Feedback to this page: click here

Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

The Cleaver: LatticeAxe

The Cleaver: LatticeAxe is designed for cleaving wafers into smaller pieces without leaving any particles on the sample. It works by making a small mark in the side of the sample that is then used as a start point for the cleaving.

The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: lattice axe should always be placed inside Fume hood 5.

Approved Materials:

Si
Quartz
Pyrex (Borofloat 33)
GaAs
InP
Sapphire

The LatticeAxe can cleave samples from 100mm down to 10mm. In some cases it can even be used on larger samples please contact wetchemistry group for more information

DTU-Nanolab has 3 different types of Cleavers see the Labadviser pages for the FlexScribe and the FlipScribe for more information.

@@ Line 1: / Line 1: @@
-==Equipment performance and process related parameters==
+'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/LatticeAxe click here]'''
-{| border="2" cellspacing="0" cellpadding="2"
+'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
-!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
+== The Cleaver: LatticeAxe ==
-|style="background:WhiteSmoke; color:black"|<b>Wafer scriber</b>
-|-
-!style="background:silver; color:black;" align="center" width="60"|Purpose
-|style="background:LightGrey; color:black"|Cleaving samples in smaller pieces
-|style="background:WhiteSmoke; color:black"|
-|-
+The Cleaver: LatticeAxe is designed for cleaving wafers into smaller pieces without leaving any particles on the sample. It works by making a small mark in the side of the sample that is then used as a start point for the cleaving.
-!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
-|style="background:LightGrey; color:black"|Scribe lines
-|style="background:WhiteSmoke; color:black"| Lines can be made perpendicular to each other by turning chuck 90°
-|-
+The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: lattice axe should always be placed inside Fume hood 5.
-!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
-|style="background:LightGrey; color:black"|Wafer thickness
-|style="background:WhiteSmoke; color:black"| Adjustable by increasing or decreasing the load of the diamond pen
-|-
+[[File:LatticeAxe placer prøve.JPG|400px]]
-|style="background:LightGrey; color:black"|Distance between scribe lines
-|style="background:WhiteSmoke; color:black"| Approx. 5 mm
-|-
+'''Approved Materials''':
-!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
-|style="background:LightGrey; color:black"| Size of Substrate
-|style="background:WhiteSmoke; color:black"| Up to 100 mm wafers
-|-
+*Si
-|style="background:LightGrey; color:black"|Allowed materials
+*Quartz
-|style="background:WhiteSmoke; color:black"| All but only Si where the scribe lines are made
+*Pyrex (Borofloat 33)
+*GaAs
+*InP
+*Sapphire
+The LatticeAxe can cleave samples from 100mm down to 10mm. In some cases it can even be used on larger samples please contact wetchemistry group for more information
-|-
+DTU-Nanolab has 3 different types of Cleavers see the Labadviser pages for the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/FlexScribe FlexScribe]''' and the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/FlipScribe FlipScribe]''' for more information.
-|}
-<br clear="all" />