Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
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<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i> | |||
= Deposition of Cu = | = Deposition of Cu = | ||
Copper can be deposited by e-beam evaporation or sputtering at Nanolab. In the chart below you can compare the different deposition equipment. | Copper can be deposited by e-beam evaporation or sputtering at Nanolab. We have also recently developed a process with thermal evaporation (2024). In the chart below you can compare the different deposition equipment. Further down you will find some results of studies on Cu deposition processes. | ||
==Studies of Cu deposition== | |||
[[/Deposition of Copper|Roughness of Cu layers]] - ''Roughness of Cu layers deposited with the Alcatel e-beam evaporator'' | [[/Deposition of Copper/Resistive thermal evaporation of Copper|Resistive thermal evaporation of copper]] | ||
[[/Deposition of Copper|Roughness of Cu layers]] - ''Roughness of Cu layers deposited with the Alcatel e-beam evaporator'' - this particular machine has been decommissioned, but the results may still be of interest. | |||
[[Specific_Process_Knowledge/Thin_film_deposition/Lesker/Stress_dependence_on_sputter_parameters_in_the_Lesker_sputter_system#Cu:_Low_stress|Stress in sputtered Cu]] - ''Low stress in Cu films sputtered with the Sputter-System (Lesker)'' | [[Specific_Process_Knowledge/Thin_film_deposition/Lesker/Stress_dependence_on_sputter_parameters_in_the_Lesker_sputter_system#Cu:_Low_stress|Stress in sputtered Cu]] - ''Low stress in Cu films sputtered with the Sputter-System (Lesker)'' | ||
==Comparison of equipment for Cu deposition== | |||
{| border="1" cellspacing="0" cellpadding="3" | {| border="1" cellspacing="0" cellpadding="3" | ||
|-style="background:silver; color:black" | |-style="background:silver; color:black" | ||
! | ! | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator|E-beam evaporator (10-pockets)]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]]) | |||
|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
| Line 25: | Line 32: | ||
|Sputter deposition of Cu | |Sputter deposition of Cu | ||
(not line-of-sight deposition) | (not line-of-sight deposition) | ||
|Sputter deposition of Cu | |||
(not line-of-sight deposition) | |||
|- | |- | ||
| Line 31: | Line 39: | ||
!Pre-clean | !Pre-clean | ||
|Ar ion | |Ar ion etch (only in E-beam evaporator Temescal) | ||
|RF Ar clean | |||
|RF Ar clean | |RF Ar clean | ||
| Line 39: | Line 48: | ||
!Layer thickness | !Layer thickness | ||
|10Å to 1µm* | |10Å to 1µm* | ||
|10Å to 1µm** | |||
|10Å to 1µm** | |10Å to 1µm** | ||
| Line 45: | Line 55: | ||
! Deposition rate | ! Deposition rate | ||
| | |1-10 Å/s | ||
| | |~ 1 Å/s | ||
|Depends on process parameters, at least up to 8.7 Å/s, see conditions [[Specific_Process_Knowledge/Thin_film_deposition/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Standard_recipe_performance|here]] | |||
|- | |- | ||
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*smaller pieces | *smaller pieces | ||
*Up to 1x6" wafers | *Up to 1x6" wafers | ||
| | |||
*Up to 10x4" or 6" wafers | |||
*or many smaller pieces | |||
|- | |- | ||
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| | | | ||
* | * Almost any that does not degas - also if you plan to use heating. | ||
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet] | *See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet] | ||
| | | | ||
* | * Almost any that does not degas. | ||
* | *See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=167 cross-contamination sheet] | ||
| | | | ||
*Almost that does not degas also if you plan to heat the substrate - see cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3] | |||
|} | |} | ||
''' | '''*''' ''To deposit layers thicker than 600 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)'' | ||
'''*''' ''To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)'' | '''**''' ''To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)'' | ||