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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab click here]'''
<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b><br>
All images and photos on this page belongs to <b>DTU Nanolab</b></i>


= XRD SmartLab =
= XRD SmartLab =
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The Rigaku SmartLab is an advanced XRD for measuring on thin films. All thin films can be measured without fixating the sample, as the system has a so called In-Plane arm.
The Rigaku SmartLab is an advanced XRD for measuring on thin films. All thin films can be measured without fixating the sample, as the system has a so called In-Plane arm.


[[image:XRD_SmartLab.jpg|200x200px|right|thumb|The XRD SmartLab located in cleanroom F-2]]
[[image:XRD_SmartLab.jpg|400x400px|right|thumb|The XRD SmartLab located in cleanroom F-2]]




'''The user manual(s), user APV(s), technical information, and contact information can be found in LabManager:'''  
'''The user manual(s), user APV(s), technical information, and contact information can be found in LabManager:'''  


[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=428 XRD SmartLab in LabManager]
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=428 XRD SmartLab in LabManager] - requires login
 
'''For XRD SmartLab Users at Nanolab:''' There's a bug in the software in the cleanroom, so the Parts Help doesn't show up with useful information about the optics used in Optical and Sample Alignment when you click the '?'. We copied the Parts Help from the newer XRD Rot Anode so you can the information:
*On the Desktop of the Smartlab computer in the cleanroom
*In the Cleanroom Drive under _Equipment/XRD/PartsHelp_fromXRDRotAnode_SLSII




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[http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Characterization/XRD/Process_Info  Process information]
[http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Characterization/XRD/Process_Info  Process information]
The measurement settings and results of the pre-acceptance test are described in this document, also found on the Lab Manager:
*[https://labmanager.dtu.dk/view_binary.php?fileId=5413| (FAT) Factory Acceptance Test]  - requires login
The same measurement were completed as part of the acceptance, but no report was generated. In addition the inspection certificate is available here:
*[https://labmanager.dtu.dk/view_binary.php?fileId=5414| (SAT) Site Acceptance Test]  - requires login


==Software for analysis==
==Software for analysis==
The software packages used for data analysis are available on the equipment computer, but we recommend that you install it on your personal computer. To run the software you need a USB dongle with a license on, these can be borrowed from the equipment responsible (in 2020, these were Kristian, Evgeniy, and Rebecca). We only have 9 dongles available, so when you are done please return the dongle to Nanolab.
Please see the Data Analysis section at the main [[Specific Process Knowledge/Characterization/XRD|XRD page]].
 
==Characterization of thin films using X-ray reflectivity (XRR)==


The software can be found on "CleanroomDrive\_Equipment\XRD\Rigaku software\RILauncher", it should be possible to install the software without a dongle. To use the software you have to log in. The user is: Administrator. There is no password.
Implementing the XRR method the user can calculate thickness, density, and roughness of the deposited material. The XRR is also widely employed for multilayer stack analysis.
 
Here are some results available:
 
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Aluminium/Al_Ebeam_evaporation_in_Temescal|e-beam deposited Al thin films]].
 
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Aluminium/Al_Sputtering_in_Cluster_Lesker_PC3#X-ray_reflectivity_analysis|DC sputtered Al thin films]].
 
* Characterization of [[Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab/ALD_deposited_alumina_and_titania_XRR#X-ray_reflectivity_results|ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> ultrathin layers]].
 
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_CrSi#X-ray_Reflectivity_Analysis|Sputtered deposited CrSi bilayer]].
 
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_MgO#X-Ray_Reflectivity|Sputtered deposited MgO thin films]].
 
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Scandium/Sc_Sputtering_in_Cluster_Lesker_PC3#X-ray_Reflectivity_(XRR)|Sputtered deposited Sc thin films]].
 
* Characterization of [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Scandium_Nitride/ScN_Reactive_Sputtering_in_Cluster_Lesker_PC3#X-ray_Reflectivity_(XRR)|Sputtered deposited ScN thin films]].
 
<!-- * Characterization of [[Specific_Process_Knowledge/Characterization/XRD/XRD_SmartLab/ALD_deposited_alumina_and_titania_XRR_and_SE_comparison|ALD deposited Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> ultrathin layers]].-->
 
==Grazing Incidence X-ray Diffraction XRD (GiXRD)==
 
* Evaluation of [[Specific Process Knowledge/Characterization/XRD/XRD SmartLab/Instrumental broading in GiXRD|Instrumental broading in GiXRD]].
 
 
==θ/2θ X-ray Diffraction==
 
* Evaluation of [[Specific Process Knowledge/Characterization/XRD/XRD SmartLab/Instrumental broading in T2T|Instrumental broadening in symmetrical θ/2θ measurements]].


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==
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0.4 mm x 8 mm (Line/Point)
0.4 mm x 8 mm (Line/Point)
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="5"|Goniometer
!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Goniometer
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
Scanning mode
Scanning mode
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*Rx,Ry:-5~+5°
*Rx,Ry:-5~+5°
|-
|-
|style="background:LightGrey; color:black"|
 
Sample size
|style="background:WhiteSmoke; color:black"|
Diameter: 150 mm
Thickness: 0~21 mm
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Optics
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Optics
|style="background:LightGrey; color:black"|Incident side
|style="background:LightGrey; color:black"|Incident side
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|style="background:LightGrey; color:black"|Substrate size
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
up to 150 mm wafers
up to 150 mm wafers; thickness up to 21 mm
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
All materials
All materials allowed in the cleanroom
|-  
|-  
|}
|}


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