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Specific Process Knowledge/Thin film deposition/Deposition of TiW: Difference between revisions

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<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>
Deposition of TiW alloy can be done in the Wordentec. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).
 
 


==Sputtering of TiW==
==Sputtering of TiW==


* [[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]]
Deposition of TiW alloy was done in the past in the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]. This tool is now decommissioned, and if necessary processes may be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).
 
 
 
{| border="1" cellspacing="0" cellpadding="4"
|-style="background:silver; color:black"
|
! Sputter deposition (Wordentec)
|-style="background:WhiteSmoke; color:black"
! General description
| Sputter deposition of TiW
|-
|-style="background:LightGrey; color:black"
! Pre-clean
|RF Ar clean
|-
 
|-style="background:WhiteSmoke; color:black"
! Layer thickness
|.
|-
 
|-style="background:LightGrey; color:black"
 
! Deposition rate
|Depending on process parameters, see [[/Sputtering of TiW in Wordentec|here.]]
|-
 
|-style="background:WhiteSmoke; color:black"
! Batch size
|
*24x2" wafers or
*6x4" wafers or
*6x6" wafers
|-
 
|-style="background:LightGrey; color:black"
! Allowed substrates
 
|
* Silicon wafers
* Quartz wafers
* Pyrex wafers
 
|-style="background:WhiteSmoke;  color:black"
!Allowed materials
|
* Silicon oxide
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
* SU-8
* Metals
|-
 


|-style="background:LightGrey;  color:black"
*[[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]]
! Comments
*[[Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers|Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec]]
| TiW alloy: 10%/90% by weight
|}

Latest revision as of 00:34, 8 July 2025

Feedback to this page: click here

Unless otherwise stated, this page is written by DTU Nanolab internal

Sputtering of TiW

Deposition of TiW alloy was done in the past in the Wordentec. This tool is now decommissioned, and if necessary processes may be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).

Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW&oldid=53543"