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| '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW click here]''' | | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW click here]''' |
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| | | <i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i> |
| Deposition of TiW alloy can be done in the Wordentec. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).
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| ==Sputtering of TiW== | | ==Sputtering of TiW== |
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| * [[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]]
| | Deposition of TiW alloy was done in the past in the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]. This tool is now decommissioned, and if necessary processes may be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this). |
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| {| border="1" cellspacing="0" cellpadding="4"
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| |-style="background:silver; color:black"
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| ! Sputter deposition (Wordentec)
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| |-style="background:WhiteSmoke; color:black"
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| ! General description
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| | Sputter deposition of TiW
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| |-style="background:LightGrey; color:black"
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| ! Pre-clean
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| |RF Ar clean
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| |-style="background:WhiteSmoke; color:black"
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| ! Layer thickness
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| |-style="background:LightGrey; color:black"
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| ! Deposition rate
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| |Depending on process parameters, see [[/Sputtering of TiW in Wordentec|here.]]
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| |-
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| |-style="background:WhiteSmoke; color:black"
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| ! Batch size
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| *24x2" wafers or
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| *6x4" wafers or
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| *6x6" wafers
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| |-style="background:LightGrey; color:black"
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| ! Allowed substrates
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| * Silicon wafers
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| * Quartz wafers
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| * Pyrex wafers
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| |-style="background:WhiteSmoke; color:black"
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| !Allowed materials
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| * Silicon oxide
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| * Silicon (oxy)nitride
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| * Photoresist
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| * PMMA
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| * Mylar
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| * SU-8
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| * Metals
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| |-style="background:LightGrey; color:black"
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| ! Comments
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| | TiW alloy: 10%/90% by weight
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| |}
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| ==Deposited film characteristics==
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| AFM pictures show how the surface roughness is dependent on the process parameters.
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| For the sputter process, the effect and argon pressure can be set to different values. Depending on the process parameters, the deposited layers will have different characteristics: the roughness, grain size and uniformity may be differnt.
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| '''Effect 150 W, pressure 1*10<sup>-3</sup> mbar'''
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| With use of the settings 150W and 1*10<sup>-3</sup> mbar, a surface with low roughness is deposited.
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| [[Image:Tiw 150W 0 001 nr2.jpg|480x480px|center|thumb|AFM picture of sputter deposited TiW. Used settings: 150W and 1*10<sup>-3</sup> mbar.]]
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| ''Measurement done September 2008, KNIL.''
| | *[[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]] |
| | *[[Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers|Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec]] |
Feedback to this page: click here
Unless otherwise stated, this page is written by DTU Nanolab internal
Sputtering of TiW
Deposition of TiW alloy was done in the past in the Wordentec. This tool is now decommissioned, and if necessary processes may be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).
