Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions

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'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
'''All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.'''
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Thickness_Measurer click here]'''  
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Thickness_Measurer click here]'''  


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'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=198 Thickness measurer]'''
'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=198 Thickness measurer]'''
'''[http://labmanager.dtu.dk/function.php?module=Machine&view=view&page_id=169 Thickness measurer (wafers)]'''
'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=447 Thickness measurer (wafers)]'''


==Quality Control - Recipe Parameters and Limits==
==Quality Control - Recipe Parameters and Limits==
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The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year.
The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year.
*[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=198 The QC procedure]<br>
*[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=198 The QC procedure]<br>
*[http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=2062 The newest QC data]<br>
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=198 The newest QC data]<br>
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*Wafer thickness
*Wafer thickness
*Depths of larger grooves
*Depths of larger grooves
*Heigth of larger mesas
*Heigth of larger samples
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Thickness resolution  
Thickness resolution  
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|style="background:WhiteSmoke; color:black"|
*< 5 µm
*< 1 µm
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|style="background:WhiteSmoke; color:black"|
*No restrictions  
*No restrictions  
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{| border="2" cellspacing="2" cellpadding="3"
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!style="background:silver; color:black;" align="center"|
Purpose
|style="background:LightGrey; color:black"|
Thickness measurer (wafers)
|style="background:WhiteSmoke; color:black"|
*Wafer thickness
*Depths of larger grooves
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!style="background:silver; color:black" align="center"|
Performance
|style="background:LightGrey; color:black"|
Thickness resolution
|style="background:WhiteSmoke; color:black"|
*< 1 µm
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|
Substrates
|style="background:LightGrey; color:black"|
Batch size
|style="background:WhiteSmoke; color:black"|
*One sample
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| style="background:LightGrey; color:black"|Substrate materials allowed
|style="background:WhiteSmoke; color:black"|
*Only wafers
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|-  
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Latest revision as of 15:31, 6 February 2023

Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.

Feedback to this page: click here

Thickness measurer

Thickness Measurer. Positioned in cleanroom D-3

There are 2 thickness measurers in the cleanroom, both positioned in cleanroom D-3. The Thickness measurer is for measuring all sorts of samples. The thickness measurer (wafers) is solely for measuring the thickness of wafers or depths of grooves on wafers.

During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.


The user manual, technical information and contact information can be found in LabManager:

Thickness measurer Thickness measurer (wafers)

Quality Control - Recipe Parameters and Limits

Quality Control (QC) for the Thickness measurer

The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year.

Equipment performance and process related parameters

Purpose

Thickness measurer

  • Wafer thickness
  • Depths of larger grooves
  • Heigth of larger samples

Performance

Thickness resolution

  • < 1 µm

Substrates

Batch size

  • One sample
Substrate materials allowed
  • No restrictions



Purpose

Thickness measurer (wafers)

  • Wafer thickness
  • Depths of larger grooves

Performance

Thickness resolution

  • < 1 µm

Substrates

Batch size

  • One sample
Substrate materials allowed
  • Only wafers