Specific Process Knowledge/Thermal Process/Oxidation/Standard oxidation recipes: Difference between revisions

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+{{cc-nanolab}}
 '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Oxidation/Standard_oxidation_recipes click here]'''
-=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>=
+<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>
+=Standard Oxidation Recipes=
-The oxidation furnaces in the cleanroom are being used for dry and wet oxidation of silicon wafers.
+The oxidation furnaces in the cleanroom are being used for dry and wet oxidation of silicon wafers. On this page the steps in the standard oxidation recipes on the furnaces will be listed.
-On this page the steps in the standard oxidation recipes on the furnaces will be listet.
+'''Dry oxidation can be done in following furnaces:'''
-===Dry oxidation can be done in the these furnaces:===
 *A1 Boron Drive-in and Pre-dep furnace
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 *C3 Anneal-Bond furnace
 *Multipurpose Anneal furnace
+<br>
 The dry oxidation recipes in the A- and C-stack furnaces are very similar and will be described on this page.
 There are no standard recipes on the Multipurpose Anneal furnace, so no oxidation recipes will be described here.
+<br>
+<br>
-===Wet oxidation can be done in these furnaces:===
+'''Wet oxidation can be done in these furnaces:'''
 *A1 Boron Drive-in and Pre-dep furnace
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 However, there are a few differences in recipes, because water vapour can be generated by either a torch, a steamer or a bubbler. More information can be found on each furnace page.
+<br>
-Wet oxidation of III-V sample in the C2 furnace is described here:
+<br>
+'''General Remarks for Oxidation Recipes:'''
-http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Oxidation/Oxidation_on_III-V_oxidation_furnace_(C2)
-===General recipe remarks:===
 The oxidation temperature is fixed in each recipe. The temperature can be seen in the recipe name, e.g. "DRY1000" for dry oxidation at 1000 C and "WET1100" for wet oxidation at 1100 C.
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 The annealing improves... The standard annealing time is 20 minutes, but it is possible to change the time.
+<br><br>
+==Dry Oxidation Process Steps==
-==Dry oxidation recipe steps==
 '''00 STANDBY'''
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 ''Message: "Standby"''
-When the furnace is not in use, and when a recipe is selected, this will be the active step.
+This will be the active step, when the furnace is not in use, and when a recipe is selected.
-If a recipe is aborted, it will jump to the STANDBY step.
+If a recipe is aborted, it will also jump to the STANDBY step.
-The furnace is closed and kept clean by an N<sub>2</sub> flow:
+In the standby step, the furnace is closed and kept clean by an N<sub>2</sub> flow.
-* Standby temperature: 700 <sup>o</sup>C
+*Standby temperature: 700 <sup>o</sup>C
-* N<sub>2</sub> flow: 3 SLM
+*N<sub>2</sub> flow: 3 SLM
-* O<sub>2</sub> flow: 0 SLM
+*O<sub>2</sub> flow: 0 SLM
 The user has to press "Start" (on the touch screen or furnace computer) to start the recipe.
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 ''Message: "Oxidation"''
-The dry oxidation is started by flowing O<sub>2</sub through the furnace instead of N<sub>2</sub.
+The dry oxidation is started by flowing O<sub>2</sub> through the furnace instead of N<sub>2</sub.
-O<sub>2</sub> flow: 5 SLM
+*O<sub>2</sub> flow: 5 SLM
-N<sub>2</sub> flow: 0 SLM
+*N<sub>2</sub> flow: 0 SLM
 The oxidation time is a variable command, so it can be set by the user.
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 '''07 ANNEAL'''
-''Message: "Anneals/Dens"''
+''Message: "Anneal/Dens"''
 The O<sub>2</sub> gas is purged out of the furnace by an N<sub>2</sub> flow, so that the oxidation stop.
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 The wafers are annealed in N<sub>2</sub> at the same temperature as the oxidation temperature. The annealing will improve the oxide quality by making it more dense.
-N<sub>2</sub> flow: 6 SLM
+*N<sub>2</sub> flow: 6 SLM
-O<sub>2</sub> flow: 0 SLM
+*O<sub>2</sub> flow: 0 SLM
 Normally the annealing time is 20 minutes, but it is a variable command, so it can be set by the user.
+The annealing time can be changed, until the annealing step is started.
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 ''Message: "Unload wafers"''
-The user has to press "Start" (on the touch screen) or "Continue" (on the furnace computer) to close the furnace
+The recipe is paused, until the user presses "Start" (on the touch screen) or "Continue" (on the furnace computer).
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 ''Message: "Unload wafers"''
-When the furnace is open, the wafer can be unloaded.
+When the furnace is open, the wafers can be unloaded.
-Be aware of, that the wafers are very hot, so they have to cool down for about five minutes
+Place the boat on the quartz plate in front of the furnace to unload the wafers. And be aware of, that the wafers are very hot, so they have to cool down for a few minutes, before they are removed from the boat.
 When the wafers are unloaded, the user has to press "Start" (on the touch screen) or "Continue" (on the furnace computer) to close the furnace.
 The recipe then jumps to the STANDBY step, and the user can leave the furnace, after it has closed.
-If a recipe is aborted
-The standard annealing time is 20 minutes, but users can change the time. The annealing time can be changed, until the annealing step is started.