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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Germanium&action=edit&redlink=1 click here]'''
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Germanium click here]'''


''All text by DTU Nanolab staff''


== Deposition of Germanium ==
== Deposition of Germanium ==
Germanium can be deposited by thermal evaporation and e-beam evaporation.
Germanium can be deposited by thermal evaporation, e-beam evaporation, and sputtering.


==Thermal deposition==
==Resistive Thermal evaporation==
* [[/Thermal Ge deposition Wordentec|Thermal deposition of Ge in Wordentec]]


Current process information on Ge thermal evaporation:
* [[/Thermal Ge evaporation Thermal Evaporator|Resistive thermal evaporation of Ge in Thermal Evaporator - Lesker]]
Some very instrument specific deposition parameters for a now-decommissioned tool can be found here: [[/Thermal Ge deposition Wordentec|Thermal deposition of Ge in Wordentec]]


==Ge deposition equipment comparison==
==Ge deposition equipment comparison==
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|-style="background:silver; color:black"
|-style="background:silver; color:black"
!  
!  
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator|Thermal Evaporator]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator|E-beam evaporator (10-pockets)]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]])
! Sputtering ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
! Sputtering ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
|-  
|-  


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|Thermal deposition of Ge
|Thermal deposition of Ge
|E-beam deposition of Ge
|E-beam deposition of Ge
|E-beam deposition of Ge
|Sputter deposition of Ge
|Sputter deposition of Ge
|-
|-


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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Pre-clean
! Pre-clean
|none
|Ar ion etch (only in E-beam evaporator Temescal)
|RF Ar clean
|RF Ar clean
|RF Ar clean
| -
|Ar ion beam clean
|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! Layer thickness
! Layer thickness
|10Å to about 2000Å (in total distributed on all loaded wafers)
|10 Å to about 2000 Å
|10Å to about 3000Å
|few nm to about 1 µm*
|10Å to about 5000Å
|10 Å to at least 1000 Å
|10 Å to ?
|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Deposition rate
! Deposition rate
|From 0.4 Å/s up to about ~2Å/s  
|1 Å/s  
|From 5 Å/s up to 10 Å/s  
|1 Å/s - 5 Å/s  
|From 1 Å/s up to 5 Å/s
|Depends on deposition parameters
|Depends on deposition parameters
|-
|-


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! Batch size
! Batch size
|
|
*24x 2" wafers or  
*4x 2" wafers or  
*6x 4" wafers or
*3x 4" wafers or
*6x 6" wafers or
*1x 6" wafers or
*1x 8" wafers or
Many small pieces
Many small pieces
|
*1x 2" wafer or
*1x 4" wafers or
*Several smaller pieces
|
|
*Up to 4 x 6" wafer or
*Up to 4 x 6" wafer or
*3x 8" wafers (ask for special holder)
*3x 8" wafers (ask for special holder)
*Many smaller pieces  
*Many smaller pieces  
|
*1x6" wafer or
*1x4" wafer or
smaller pieces
|
*10x6" or 4" wafers
*many smaller pieces
|-
|-


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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"


! Allowed substrates
! Allowed materials
|
Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404 cross-contamination sheet].
|
|
* Silicon wafers
Almost any that does not degas at your intended substrate temperature. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=511 cross-contamination sheet].
* Quartz wafers
* Pyrex wafers
|
|
* III-V materials
*Almost any that does not degas at your intended substrate temperature.
* Silicon wafers
* Quartz wafers
* Pyrex wafers
|
|
*Silicon wafers
*Almost any that does not degas at your intended substrate temperature. See cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3]
*Quartz wafers
*Pyrex wafers
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]  
 
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"


!Allowed materials


|
|}
* Silicon oxide
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
* SU-8
* Metals
|
* Silicon oxide
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
|
*Silicon oxide
*Silicon (oxy)nitride
*Photoresist
*PMMA
*Mylar
*Metals
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]


|-style="background:LightGrey; color:black"
'''*'''  ''For cumulative deposition above 600 nm please write to metal@nanolab.dtu.dk to make sure there will be enough material present in the machine.
! Comment
|Recommended for unexposed e-beam resist
|
|
|}
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