Specific Process Knowledge/Back-end processing/Polisher CMP: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Polisher_CMP click here]''' | |||
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== Polisher (CMP) == | == Polisher (CMP) == | ||
[[image:Cmp_picture.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]] | [[image:Cmp_picture.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper in cleanroom A-5]] | ||
The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates. | The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates. After CMP it is recommended to use the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/Post_CMP_Cleaner Post CMP Cleaner]''' to clean the sample for slurry residues left by the CMP. | ||
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<!-- give the link to the equipment info page in LabManager: --> | <!-- give the link to the equipment info page in LabManager: --> | ||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=430 The Logitech Orbis (CMP) in LabManager] | [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=430 The Logitech Orbis (CMP) in LabManager] | ||
==Equipment performance and process related parameters== | ==Equipment performance and process related parameters== | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| 20x20mm substrate | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Removal rate: | *Removal rate: 400nm/min | ||
*Thickness accuracy: +/- | *Thickness accuracy: +/- ? µm | ||
*Thickness homogeneity: +/- | *Thickness homogeneity: +/- ? µm | ||
*Roughness: +/- ? µm | *Roughness: +/- ? µm | ||
<!-- |style="background:WhiteSmoke; color:black"| | <!-- |style="background:WhiteSmoke; color:black"| | ||
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*Performance range 3 --> | *Performance range 3 --> | ||
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|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|100mm substrate | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Removal rate: ~ | *Removal rate: ~ 60 nm/min | ||
*Thickness accuracy: ? µm | *Thickness accuracy: ? µm | ||
*Thickness homogeneity: ? µm | *Thickness homogeneity: ? µm | ||