LabAdviser/Technology Research/Nanoscale characterization of ultra-thin metal films for nanofabrication applications: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@ | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/LabAdviser/Technology_Research/Nanoscale_characterization_of_ultra-thin_metal_films_for_nanofabrication_applications click here]''' | ||
=Nanoscale characterization of ultra-thin metal films for nanofabrication applications= | =Nanoscale characterization of ultra-thin metal films for nanofabrication applications= | ||
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*'''Project responsible:''' Matteo Todeschini ([http://orbit.dtu.dk/en/persons/matteo-todeschini(06c8b80c-b670-4bc3-8547-f5dd723de085).html DTU Orbit]) | *'''Project responsible:''' Matteo Todeschini ([http://orbit.dtu.dk/en/persons/matteo-todeschini(06c8b80c-b670-4bc3-8547-f5dd723de085).html DTU Orbit]) | ||
*'''Supervisors:''' Prof. Jakob Birkedal Wagner, Assoc. Prof. Flemming Jensen, Assist. Prof. Anpan Han | *'''Supervisors:''' Prof. Jakob Birkedal Wagner, Assoc. Prof. Flemming Jensen, Assist. Prof. Anpan Han | ||
*'''Partners involved:''' DTU Danchip | *'''Partners involved:''' DTU Nanolab (former DTU Danchip and DTU CEN) | ||
*'''Full thesis:''' [[:File:PhDthesis_opponent changes_final.pdf|Link]] | *'''Full thesis:''' [[:File:PhDthesis_opponent changes_final.pdf|Link]] | ||
*'''Overview:''' [[/ | *'''Overview:''' [[Specific Process Knowledge/Thin film deposition/Deposition of Gold/Adhesion layers|Adhesion layers]] | ||
*'''Overview:''' [[/SEM | *'''Overview:''' [[LabAdviser/314/Microscopy 314-307/SEM/Nova/Transmission Kikuchi diffraction|Transmission Kikuchi diffraction]] | ||
==Project Description== | ==Project Description== | ||
[[File: | |||
[[File:1.png|500px|thumb|Fig. 1. Schematic representation of the "thin-film structure-property causality" approach for the fabrication of thin-films. The study of the interaction between thin-films is added as fundamental step in the process.]] | |||
The deposition of metal thin-film structures on dielectric or semiconductor substrates is central for the fabrication of structures and devices having nanoscale characteristic dimension. With the constant miniaturization of the devices and the fabrication of increasingly complex multi-material structures, the interaction between different ultra-thin layers has gained considerable importance in the field of thin-film science and technology in recent years. Therefore the characterization of such interactions in a wide range of temperatures and the description of their impact on the chemical composition, morphology and distribution of crystallographic orientations of multilayer thin-films is of utmost importance. | The deposition of metal thin-film structures on dielectric or semiconductor substrates is central for the fabrication of structures and devices having nanoscale characteristic dimension. With the constant miniaturization of the devices and the fabrication of increasingly complex multi-material structures, the interaction between different ultra-thin layers has gained considerable importance in the field of thin-film science and technology in recent years. Therefore the characterization of such interactions in a wide range of temperatures and the description of their impact on the chemical composition, morphology and distribution of crystallographic orientations of multilayer thin-films is of utmost importance. | ||
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*: [https://pubs.acs.org/doi/abs/10.1021/acsami.7b10136 Link to Article] | *: [https://pubs.acs.org/doi/abs/10.1021/acsami.7b10136 Link to Article] | ||
*: <u>M. Todeschini</u>, A. B. da Silva Fanta, F. Jensen, J. B. Wagner, and A. Han<br> ''ACS Appl. Mater. Interfaces'', vol. 9 (42), pp. 37374–37385, 2017. | *: <u>M. Todeschini</u>, A. B. da Silva Fanta, F. Jensen, J. B. Wagner, and A. Han<br> ''ACS Appl. Mater. Interfaces'', vol. 9 (42), pp. 37374–37385, 2017. | ||
** '''Overview:''' [[/ | ** '''Overview:''' [[Specific Process Knowledge/Thin film deposition/Deposition of Gold/Adhesion layers|Adhesion layers]] | ||
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*: [https://www.sciencedirect.com/science/article/pii/S1044580318300937 Link to Article] | *: [https://www.sciencedirect.com/science/article/pii/S1044580318300937 Link to Article] | ||
*: A. B. da Silva Fanta, <u>M. Todeschini</u>, A. Burrows, H. Jansen, C. D. Damsgaard, H. Alimadadi, and J. B. Wagner<br> ''Materials Characterization'', vol. 139, pp. 452-462, 2018. | *: A. B. da Silva Fanta, <u>M. Todeschini</u>, A. Burrows, H. Jansen, C. D. Damsgaard, H. Alimadadi, and J. B. Wagner<br> ''Materials Characterization'', vol. 139, pp. 452-462, 2018. | ||
** '''Overview:''' [[/SEM | ** '''Overview:''' [[LabAdviser/314/Microscopy 314-307/SEM/Nova/Transmission Kikuchi diffraction|Transmission Kikuchi diffraction]] | ||