Specific Process Knowledge/Etch/DryEtchProcessing/Bonding: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@ | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DryEtchProcessing/Bonding click here]''' | ||
<!--Checked for updates on | <!--Checked for updates on 25/11-2019 - ok/jmli --> | ||
<!--Checked for updates on 28/4-2023 - ok/jmli --> | |||
<!--Checked for updates on 4/9-2025 - ok/jmli --> | |||
{{Template:Contentbydryetch}} | |||
== Carriers for dry etching: Temporary bonding of samples or carriers for none bonded samples == | == Carriers for dry etching: Temporary bonding of samples or carriers for none bonded samples == | ||
<!--Checked for updates on 3/2-2023 - ok/jmli --> | |||
=== Purpose === | === Purpose === | ||
The dry etch tools are set up for processing one particular size of wafer. The reasons why a tool processes one size of wafers and not others are numerous - they may include: | |||
* Hardware availability | * Hardware availability | ||
* Processes required by users | * Processes required by users | ||
The dry etch tools at | The dry etch tools at Nanolab all have a default wafer size and may have other sizes of electrodes available. Other sizes of wafers or chips may also be processed but they will require the use of a carrier wafer. Using a carrier is also often required if the side of the wafer facing the electrode has structures. | ||
{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;" | {| border="2" cellpadding="2" cellspacing="1" style="text-align:center;" | ||
|+ ''' | |+ '''Processing different sizes of wafers or chips in the dry etch tools at Nanolab ''' | ||
|- | |- | ||
! Tool | ! Tool | ||
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! Sizes of wafers or chips that may bonded and processed | ! Sizes of wafers or chips that may bonded and processed | ||
|- | |- | ||
![[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-1|DRIE-Pegasus]] | ![[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-1|DRIE-Pegasus-1]] | ||
| 4" wafer | | 4" wafer | ||
| 6" wafer | | 6" wafer | ||
| Samples smaller than a 4" wafer | | Samples smaller than a 4" wafer | ||
|- | |||
![[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2|DRIE-Pegasus-2]] | |||
| 6" wafer | |||
| 4" wafer | |||
| Samples smaller than a 6" wafer | |||
|- | |- | ||
![[Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch)|ASE]] | ![[Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch)|ASE]] | ||
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<ol> | <ol> | ||
<li>Find a carrier wafer that has the right size. Keep in mind that it matters a great deal if the surface will be etched or not, i.e. if it has oxide or not. </li> | <li>Find a carrier wafer that has the right size. Keep in mind that it matters a great deal if the surface will be etched or not, i.e. if it has oxide or not. </li> | ||
<li>Take a piece of crystalbond from the shelf in cleanroom 1. </li> | <li>Take a piece of crystalbond from the shelf in cleanroom A-1. </li> | ||
<li>Take your items (substrate, carrier wafer, crystalbond and tweezers) to the hotplate in cleanroom 1. </li> | <li>Take your items (substrate, carrier wafer, crystalbond and tweezers) to the hotplate in cleanroom C-1. </li> | ||
[[image:bonding-n01x.jpg]] | [[image:bonding-n01x.jpg]] | ||
<li>Put the carrier wafer on the hotplate. A 6" wafer will fit not in the recess but it will get sufficiently hot if you leave it there for some seconds longer. </li> | <li>Put the carrier wafer on the hotplate. <!-- A 6" wafer will fit not in the recess but it will get sufficiently hot if you leave it there for some seconds longer. --> </li> | ||
<li>Apply a very thin layer of crystalbond in a circular motion so that it covers some 70 % of the area to be covered by your substrate. Do not apply too much! Little does it.. </li> | <li>Apply a very thin layer of crystalbond in a circular motion so that it covers some 70 % of the area to be covered by your substrate. Do not apply too much! Little does it.. </li> | ||
<li>Gently put your wafer on the crystalbond. </li> | <li>Gently put your wafer on the crystalbond. </li> | ||