Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions

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-This is a micrometer-screw.
+{{cc-nanolab}}
-[[image:Mikrometerskrue_hel_a.JPG|200x200px|right|thumb|The Thickness measurer in Cleanroom 3 ]]
+'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Thickness_Measurer click here]'''
+<br>
+<br>
+==Thickness Measurer==
+[[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Thickness Measurer. Positioned in cleanroom D-3]]
-It measures with an accurracy within a few µm.
+There are 2 thickness measurers in the cleanroom, both positioned in cleanroom D-3. The Thickness measurer is for measuring all sorts of samples. The thickness measurer (wafers) is solely for measuring the thickness of wafers or depths of grooves on wafers.
-The range is from a few µm up to 5mm.
-Measure the wafer in the box next to the meter. If this is ok, then other wafers can be measured.
+During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.
-There is a calibration device by the DEKTAK.
-It is calibrated at 750µm.
+The user manual, technical information and contact information can be found in
+[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=198 LabManager].
+==Quality Control - Recipe Parameters and Limits==
+{| border="1" cellspacing="2" cellpadding="2" colspan="3"
+|bgcolor="#98FB98" |'''Quality Control (QC) for the Thickness measurer'''
+|-
+|
+The measured standard thickness is 0.1 mm. The measured result has to be within &plusmn; 0.005 mm. The QC is preformed once a year.
+*[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=198 The QC procedure]<br>
+*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=198 The newest QC data]<br>
+|}
+<br> <br>
+==Equipment performance and process related parameters==
+{| border="2" cellspacing="2" cellpadding="3"
+|-
+!style="background:silver; color:black;" align="center"|
+Purpose
+|style="background:LightGrey; color:black"|
+Thickness measurer
+|style="background:WhiteSmoke; color:black"|
+*Wafer thickness
+*Depths of larger grooves
+*Heigth of larger samples
+|-
+!style="background:silver; color:black" align="center"|
+Performance
+|style="background:LightGrey; color:black"|
+Thickness resolution
+|style="background:WhiteSmoke; color:black"|
+*< 1 µm
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="2"|
+Substrates
+|style="background:LightGrey; color:black"|
+Batch size
+|style="background:WhiteSmoke; color:black"|
+*One sample
+|-
+| style="background:LightGrey; color:black"|Substrate materials allowed
+|style="background:WhiteSmoke; color:black"|
+*No restrictions
+|-
+|}
+<br>
+{| border="2" cellspacing="2" cellpadding="3"
+|-
+!style="background:silver; color:black;" align="center"|
+Purpose
+|style="background:LightGrey; color:black"|
+Thickness measurer (wafers)
+|style="background:WhiteSmoke; color:black"|
+*Wafer thickness
+*Depths of larger grooves
+|-
+!style="background:silver; color:black" align="center"|
+Performance
+|style="background:LightGrey; color:black"|
+Thickness resolution
+|style="background:WhiteSmoke; color:black"|
+*< 1 µm
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="2"|
+Substrates
+|style="background:LightGrey; color:black"|
+Batch size
+|style="background:WhiteSmoke; color:black"|
+*One sample
+|-
+| style="background:LightGrey; color:black"|Substrate materials allowed
+|style="background:WhiteSmoke; color:black"|
+*Only wafers
+|-
+|}