Specific Process Knowledge/Thin film deposition/Deposition of TiW: Difference between revisions

Latest revision as of 23:34, 7 July 2025

Feedback to this page: click here

Unless otherwise stated, this page is written by DTU Nanolab internal

Sputtering of TiW

Deposition of TiW alloy was done in the past in the Wordentec. This tool is now decommissioned, and if necessary processes may be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).

@@ Line 1: / Line 1: @@
-Deposition of TiW alloy can take place in the Wordentec.
+'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW click here]'''
-This is done by a sputtering process, process parameters (argon pressure and effect) can be varied, and the deposition rate and surface roughness may change with these settings.
+<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>
+==Sputtering of TiW==
+Deposition of TiW alloy was done in the past in the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]. This tool is now decommissioned, and if necessary processes may be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).
+*[[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]]
+*[[Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers|Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec]]