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Specific Process Knowledge/Thin film deposition/Deposition of TiW: Difference between revisions

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Deposition of TiW alloy can take place in the Wordentec.
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This is done by a sputtering process, process parameters (argon pressure and effect) can be varied, and the deposition rate and surface roughness may change with these settings.
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==Sputtering of TiW==
 
Deposition of TiW alloy was done in the past in the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]. This tool is now decommissioned, and if necessary processes may be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).
 
*[[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers|Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec]]
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