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Specific Process Knowledge/Lithography/EBeamLithographyManual: Difference between revisions

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To request for an e-beam training session, contact e-beam@danchip.dtu.dk; a DTU Danchip personnel will hereafter provide a time slot. For safety reasons, even fully trained users are only authorized to mount substrates into the e-beam cassettes but not authorized to load the cassettes into the autoloader.
To request for an e-beam training session, contact e-beam@nanolab.dtu.dk; a DTU Nanolab personnel will hereafter provide a time slot. For safety reasons, even fully trained users are only authorized to mount substrates into the e-beam cassettes but not authorized to load the cassettes into the autoloader.
   
   


To use the e-beam writer, book the machine via LabManager, and ask help from DTU Danchip staff to load your cassette into the robot loader (autoloader).
To use the e-beam writer, book the machine via LabManager, and ask help from DTU Nanolab staff to load your cassette into the robot loader (autoloader).


   
   
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After your exposure, fully trained users can unload their cassettes from the autoloader, unmount their substrates and leave the cassette on the designated table.
After your exposure, fully trained users can unload their cassettes from the autoloader, unmount their substrates and leave the cassette on the designated table.


If you are prohibited to unmount your substrates before another user requires the cassette, you must accept that either the next user or DTU Danchip personel unmount your substrates.
If you are prohibited to unmount your substrates before another user requires the cassette, you must accept that either the next user or DTU Nanolab personel unmount your substrates.
When un-mounting someone's sample, please place them in a single carrier box, with your initials in parentheses, and write - out of E-beam - date - cassette and slot.
When un-mounting someone's sample, please place them in a single carrier box, with your initials in parentheses, and write - out of E-beam - date - cassette and slot.


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The computer controlling the e-beam (EWS/9500 New) is located in the controller room which is a class 100 cleanroom area. The computers supporting the conversion of the e-beam files are also located in the controller room.
The computer controlling the e-beam (EWS/9500 New) is located in the controller room which is a class 100 cleanroom area. The computers supporting the conversion of the e-beam files are also located in the controller room.
Manuals


There are 3 manuals for the e-beam writer; apart from the main manual (this manual) there is a sdf and jdf-file manual, and a BEAMER manual. They can both be accessed from LabManager under Technical documents.
==Manuals==
 
There are 4 manuals for the e-beam writer; apart from the main manual (this manual) there is a sdf and jdf-file manual, a BEAMER manual and a 2D mark detection manual. They can all be accessed from LabManager under Technical documents.




The original JEOL manual for the e-beam writer FS9500 is located on the O-drive: O:\CleanroomDrive\_Equipment\E-beam
The original JEOL manual for the e-beam writer FS9500 is located on the O-drive: O:\CleanroomDrive\_Equipment\E-beam
Technical Specification
 
==Technical Specification==
The system can be characterized as follows:
The system can be characterized as follows:


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*Electron-beam scanning speeds, f, up to 100 MHz are available (which is maximum scan speed).
*Electron-beam scanning speeds, f, up to 100 MHz are available (which is maximum scan speed).
*The acceleration voltage is 100 kV.
*The acceleration voltage is 100 kV.
*The e-beam writer can pattern structures with a minimum resolution of 12 nm.
*The e-beam writer can pattern structures with a minimum reproducible resolution of 7 nm, depending on the resist type.
*The maximum field-size without stitching is 1000µm x 1000µm.
*The maximum field-size without stitching is 1000µm x 1000µm, but can be smaller if needed.
*The machine has cassettes that can contain either 6 wafers of 2” in size, 2 or 3 wafers of 4” in size, 1 wafer of 6” in size, 1 wafer of 8” in size, 4 chips of different sizes(slot sizes 4 mm, 8 mm, 12 mm, and 20 mm)
*The machine has cassettes that can contain either 6 wafers of 2” in size, 2 or 3 wafers of 4” in size, 1 wafer of 6” in size, 1 wafer of 8” in size, 4 chips of different sizes(slot sizes 4 mm, 8 mm, 12 mm, and 20 mm)


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== Rough estimation of exposure time ==
== Rough estimation of exposure time ==


[[File:currentbeamsize.jpg|400px|right]]
[[Image:old_and_new_column_beam_size_in_one_page_March172019.jpg|400px|right|]]


Based on the equations above, a rough estimate of the exposure time is easily calcualted. In the second sheet of the e-beam logbook, a simple program for calculating the scan speed frequency and an estimation of the exposure time can be found. Note, that the actual writing time will exceed the exposure-time, as the exposure-time calculation doesn’t include pre-calibrations and stage movement during exposure.
Based on the equations above, a rough estimate of the exposure time is easily calcualted. In the second sheet of the e-beam logbook, a simple program for calculating the scan speed frequency and an estimation of the exposure time can be found. Note, that the actual writing time will exceed the exposure-time, as the exposure-time calculation doesn’t include pre-calibrations and stage movement during exposure.