Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions
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'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.''' | |||
'''All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.''' | |||
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Thickness_Measurer click here]''' | '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Thickness_Measurer click here]''' | ||
==Thickness measurer== | ==Thickness measurer== | ||
[[Image:Thicknessmeasurer2007.jpg|thumb|300x300px| | [[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Thickness Measurer. Positioned in cleanroom D-3]] | ||
The | There are 2 thickness measurers in the cleanroom, both positioned in cleanroom D-3. The Thickness measurer is for measuring all sorts of samples. The thickness measurer (wafers) is solely for measuring the thickness of wafers or depths of grooves on wafers. | ||
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching. | |||
'''The user manual, technical information and contact information can be found in LabManager:''' | '''The user manual, technical information and contact information can be found in LabManager:''' | ||
'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach= | '''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=198 Thickness measurer]''' | ||
'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=447 Thickness measurer (wafers)]''' | |||
==Quality Control - Recipe Parameters and Limits== | ==Quality Control - Recipe Parameters and Limits== | ||
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The measured standard thickness is 0.1 mm. The QC is | The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year. | ||
*[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach= | *[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=198 The QC procedure]<br> | ||
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=198 The newest QC data]<br> | |||
|} | |} | ||
==Equipment performance and process related parameters== | ==Equipment performance and process related parameters== | ||
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*Wafer thickness | *Wafer thickness | ||
*Depths of larger grooves | *Depths of larger grooves | ||
*Heigth of larger | *Heigth of larger samples | ||
|- | |- | ||
!style="background:silver; color:black" align="center"| | !style="background:silver; color:black" align="center"| | ||
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Thickness resolution | Thickness resolution | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*< | *< 1 µm | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"| | !style="background:silver; color:black" align="center" valign="center" rowspan="2"| | ||
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|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*No restrictions | *No restrictions | ||
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{| border="2" cellspacing="2" cellpadding="3" | |||
|- | |||
!style="background:silver; color:black;" align="center"| | |||
Purpose | |||
|style="background:LightGrey; color:black"| | |||
Thickness measurer (wafers) | |||
|style="background:WhiteSmoke; color:black"| | |||
*Wafer thickness | |||
*Depths of larger grooves | |||
|- | |||
!style="background:silver; color:black" align="center"| | |||
Performance | |||
|style="background:LightGrey; color:black"| | |||
Thickness resolution | |||
|style="background:WhiteSmoke; color:black"| | |||
*< 1 µm | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="2"| | |||
Substrates | |||
|style="background:LightGrey; color:black"| | |||
Batch size | |||
|style="background:WhiteSmoke; color:black"| | |||
*One sample | |||
|- | |||
| style="background:LightGrey; color:black"|Substrate materials allowed | |||
|style="background:WhiteSmoke; color:black"| | |||
*Only wafers | |||
|- | |- | ||
|} | |} | ||
Latest revision as of 15:31, 6 February 2023
Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.
All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.
Feedback to this page: click here
Thickness measurer
There are 2 thickness measurers in the cleanroom, both positioned in cleanroom D-3. The Thickness measurer is for measuring all sorts of samples. The thickness measurer (wafers) is solely for measuring the thickness of wafers or depths of grooves on wafers.
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.
The user manual, technical information and contact information can be found in LabManager:
Thickness measurer Thickness measurer (wafers)
Quality Control - Recipe Parameters and Limits
| Quality Control (QC) for the Thickness measurer |
|
The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year. |
|
Purpose |
Thickness measurer |
|
|---|---|---|
|
Performance |
Thickness resolution |
|
|
Substrates |
Batch size |
|
| Substrate materials allowed |
|
|
Purpose |
Thickness measurer (wafers) |
|
|---|---|---|
|
Performance |
Thickness resolution |
|
|
Substrates |
Batch size |
|
| Substrate materials allowed |
|