Specific Process Knowledge/Back-end processing/Die Bonder: Difference between revisions

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'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder click here]'''
'''Feedback to this page''': '''[mailto:fabricationsupport@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder click here]'''
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[[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|thumb|The Die-bonder Cammax EDB-80 is placed in Danchip's Packlab building 347, 1. floor.]]
[[image:Die-bonder_Cammax_EDB-80.jpg|200x200px|thumb|The Die-bonder Cammax EDB-80 is placed in the Packlab in building 347, 1st floor.]]
[[image:DieBonderHeatingChuck.jpg|200x300px|thumb|Heating Chuck on the Die-bonder]]
[[image:DieBonderHeatingChuck.jpg|200x300px|thumb|Heating Chuck on the Die-bonder]]
== Die bonder (eutectic metal soldering) ==
== Die bonder (eutectic metal soldering) ==


The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.  
The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.  
[[Image:section under construction.jpg|70px]] ''Will be temporary taken out of service during the PolyFabLab construction.''


The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.
The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.
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<!-- give the link to the equipment info page in LabManager: -->
<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=306 Die Bonder in LabManager]
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=306 Die Bonder in LabManager]


== Process information ==
== Process information ==


*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding|Au-Sn eutectic die bonding]]
*[[Specific Process Knowledge/Back-end processing/Au-Sn eutectic die bonding|Au-Sn eutectic die bonding]]
 
<br/>
== Flip-chip bonder (glue attachment) ==
<br/>
 
<br/>
[[image:Flip_chip_Bonder_dr_Tresky.jpg|200x200px|right|thumb|The Flip chip bonder is placed in Danchip's Packlab building 347, 1. floor.]]
<br/>
 
<br/>
The flip chip bonder can be used to place chips on a substrate with high precision. This way electrical contacts can be made between contact pads on the chip and substrate.
<br/>
 
<br/>
With a dispensing tool small amounts of solder paste or glue is dispensed on the substrate with high accuracy. The substrate could for example be a printed circuit board (PCB). After some experience with the machine, it is possible to place dots with different shapes and sizes on the surface. With a placement tool a chip can then be picked up upside down and by the use of a camera unit, it is possible to align the contacts on the chip to the solder/glue dots on the on the substrate before joining the two surfaces with a light pressure. The stack is subsequently cured and an underfill glue can be dispensed to enhance the bonding strength between chip and substrate.
<br/>
 
The Flip Chip Bonder is placed in Danchip's Packlab building 347, 1. floor.
 
'''The user manuals, user APVs, technical information and contact information can be found in LabManager:'''
 
<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=319 Flip-chip Bonder in LabManager]


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|<b>Die bonder</b>
|style="background:WhiteSmoke; color:black"|<b>Die bonder</b>
|style="background:WhiteSmoke; color:black"|<b>Flip-chip bonder</b>
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
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*Fine placement of dies
*Fine placement of dies
*Eutectic metal soldering
*Eutectic metal soldering
|style="background:WhiteSmoke; color:black"|
*Fine placement of dies
*Glue attachment
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Performance
!style="background:silver; color:black;" align="center" width="60"|Performance
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*Low thermal resistance
*Low thermal resistance
*Always conducting
*Always conducting
|style="background:WhiteSmoke; color:black"|
*Medium or High thermal resistance
*Possibility of both conducting and isolating adhesives
*If an epoxy based adhesive is used the user is required to have the epoxy course.
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
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*Should be able to withstand the soldering temperature
*Should be able to withstand the soldering temperature
*Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)
*Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)
|style="background:WhiteSmoke; color:black"|
*Any that is compatible with the glue and temperature used
|-  
|-  
|}
|}


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Latest revision as of 14:59, 6 March 2023

Feedback to this page: click here

The Die-bonder Cammax EDB-80 is placed in the Packlab in building 347, 1st floor.
Heating Chuck on the Die-bonder

Die bonder (eutectic metal soldering)

The Cammax EDB80 Die bonder is for placing and soldering dies onto a package or substrate.

Will be temporary taken out of service during the PolyFabLab construction.

The bonder has a graphite heater element enabling fast heating to the melting point of the solder. To prevent oxidation of the solder and bonding surfaces it is possible to have a gas flow of formier gas (4-10% H2 in N2) over the sample. The machine also has a pick-up tool enabling accurate placement of the sample onto a carrier.

The user manuals, user APVs, technical information and contact information can be found in LabManager:

Die Bonder in LabManager

Process information









Equipment performance and process related parameters

Equipment Die bonder
Purpose
  • Fine placement of dies
  • Eutectic metal soldering
Performance
  • Low thermal resistance
  • Always conducting
Substrates Allowed materials
  • Should be able to withstand the soldering temperature
  • Typical materials are: Alumina (Al2O3), AluminumNitride (AlN)


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