Specific Process Knowledge/Thin film deposition/Physimeca: Difference between revisions

Latest revision as of 09:45, 6 June 2023

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Unless otherwise stated, this page is written by DTU Nanolab internal

Physimeca - This tool has been decommissioned

The Physicmeca, Located in cleanroom B-1.

Physimeca is a system for deposition of metals through electron-beam evaporation.

Wafers are loaded into the system through the load lock and transferred into the deposition chamber. Physimeca allows you to deposit metals on samples up to 4 inch wafer. There are three different sample holders, one for chips (arbitrary size), one for 2" wafers and one for 4" wafers. The sample holder can be tilted during deposition, but is normally kept in a horizontal orientation.

Six different metals are present at each time in the Physimeca. The metal combination is changed if needed. A list of currently allowed metals is included in the table below; contact the ThinFilm team (Metal@nanolab.dtu.dk) if you have wishes for other metals.

The user manual and contact information can be found in LabManager:

Physimeca in LabManager

Equipment performance and process related parameters Physimeca

Purpose	Deposition of metals	E-beam evaporation of metals
Performance	Film thickness	10 Å - 5000 Å*
Performance	Available metals and deposition rates (Å/s)	Gold (Au) 10 Chromium (Cr) 5 Platinum (Pt) 5 Titanium (Ti) 5 Nickel (Ni) 5 Germanium (Ge) 5 Palladium (Pd) 5 Silver (Ag)
Process parameter range	Process Temperature	Less then 80 ^oC
	Process pressure	2x10^-6 mbar
	Distance between e-beam and substrate	46 cm
Substrates	Sample size	one 2" or 4" wafers Or several smaller pieces
	Substrate material allowed	III-V materials Si
	Materials allowed on the substrate	Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar

* For thicknesses above 2000 Å special permission is required (contact thinfilm@nanolab.dtu.dk).

Calibration of Physimeca - for experienced users only

@@ Line 1: / Line 1: @@
 '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Physimeca click here]'''
+<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>
 [[Category: Equipment|Thin film Physimeca]]
 [[Category: Thin Film Deposition|Physimeca]]
-== Physimeca ==
+== Physimeca - <span style="color:Red"> This tool has been decommissioned</span>==
-[[image:Physimeca.jpg|430x430px|right|thumb|The Physicmeca, placed in the III-V laboratory, cleanroom A-5.]]
+[[image:Physimeca.jpg|430x430px|right|thumb|The Physicmeca, Located in cleanroom B-1.]]
-Physimeca is a system for deposition of metals through electron-beam evaporation, intended for III-V processing.
+Physimeca is a system for deposition of metals through electron-beam evaporation.
-Wafers are loaded into the system through the load lock and transferred into the deposition chamber. Physimeca allows you to deposit metals on samples of different sizes and shapes. It will also take samples of almost any shape as long as they can fit on the sample holders; there are three different sample holders, one for chips (arbitrary size), one for 2" wafers and one for 4" wafers. The sample holder can be tilted during deposition, but is normally kept in a horizontal orientation.
+Wafers are loaded into the system through the load lock and transferred into the deposition chamber. Physimeca allows you to deposit metals on samples up to 4 inch wafer. There are three different sample holders, one for chips (arbitrary size), one for 2" wafers and one for 4" wafers. The sample holder can be tilted during deposition, but is normally kept in a horizontal orientation.
-Six different metals are present at each time in the Physimeca. The metal combination is changed if needed. A list of currently allowed metals is included in the table below; contact the ThinFilm team (thinfilm@danchip.dtu.dk) if you have wishes for other metals.
+Six different metals are present at each time in the Physimeca. The metal combination is changed if needed. A list of currently allowed metals is included in the table below; contact the ThinFilm team (Metal@nanolab.dtu.dk) if you have wishes for other metals.
@@ Line 22: / Line 24: @@
 <br clear="all" />
 ==Equipment performance and process related parameters Physimeca==
@@ Line 36: / Line 37: @@
 |style="background:LightGrey; color:black"|Film thickness||style="background:WhiteSmoke; color:black"|
 *10 Å - 5000 Å*
-*Throw distance 46 cm
 |-
 |style="background:LightGrey; color:black"|Available metals and deposition rates (Å/s)
@@ Line 49: / Line 50: @@
 *Silver (Ag)
 |-
-!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter range
+!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Process parameter range
 |style="background:LightGrey; color:black"|Process Temperature
 |style="background:WhiteSmoke; color:black"|
@@ Line 57: / Line 58: @@
 |style="background:WhiteSmoke; color:black"|
 * 2x10<sup>-6</sup> mbar
+|-
+|style="background:LightGrey; color:black"|Distance between e-beam and substrate
+|style="background:WhiteSmoke; color:black"|
+* 46 cm
 |-
 !style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
-|style="background:LightGrey; color:black"|Batch size
+|style="background:LightGrey; color:black"|Sample size
 |style="background:WhiteSmoke; color:black"|
-*2 or 4" wafers
+*one 2" or 4" wafers
 *Or several smaller pieces
@@ Line 80: / Line 85: @@
 |}
-'''*''' ''For thicknesses above 2000 Å special permission is required (contact thinfilm@danchip.dtu.dk).''
+'''*''' ''For thicknesses above 2000 Å special permission is required (contact thinfilm@nanolab.dtu.dk).''
 == [[/Physimeca_calibration|Calibration of Physimeca]] '' - for experienced users only'' ==