Specific Process Knowledge/Thermal Process/Furnace: Multipurpose annealing: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@ | ==From February 2024: RESIST PYROLYSIS FURNACE== | ||
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Furnace:_Multipurpose_annealing#Multipurpose_annealing_furnace click here]''' | |||
''This page is written by DTU Nanolab internal'' | |||
[[Category: Equipment |Thermal A2]] | [[Category: Equipment |Thermal A2]] | ||
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==The Multipurpose annealing furnace== | ==The Multipurpose annealing furnace== | ||
[[Image:ATV_ovn.jpg|thumb|365x365px|Multipurpose Annealing Furnace. Positioned in cleanroom B-1]] | [[Image:ATV_ovn.jpg|thumb|365x365px|Multipurpose Annealing Furnace. Positioned in cleanroom B-1. Photo: DTU Nanolab internal]] | ||
[[Image:ATV_ovn_boat.jpg|thumb|335x335px|Boat with wafers for the Multipurpose Annealing Furnace.]] | [[Image:ATV_ovn_boat.jpg|thumb|335x335px|Boat with wafers for the Multipurpose Annealing Furnace. Photo: DTU Nanolab internal]] | ||
The Multipurpose Annealing Furnace it made by ATV Technologie, and it was installed in the cleanroom in 2015. | The Multipurpose Annealing Furnace it made by ATV Technologie, and it was installed in the cleanroom in 2015. | ||
The purpose of the Multipurpose Annealing Furnace is annealing and dry oxidation of different samples and resist pyrolysis. | The purpose of the Multipurpose Annealing Furnace is annealing and dry oxidation of different samples and resist pyrolysis. Annealing and resist pyrolysis can be done in vacuum or at atmospheric pressure, in a N<sub>2</sub> or H<sub>2</sub> atmosphere or a mixture of the two gasses. | ||
All process gasses (except purge nitrogen) are heated, before they are introduced into the furnace at the door side. | All process gasses (except purge nitrogen) are heated, before they are introduced into the furnace at the door side. | ||
Is is possible to change all quartz ware in the furnace (the furnace tube, the door sealing and the wafer boat). At the moment | Is is possible to change all quartz ware in the furnace (the furnace tube, the door sealing and the wafer boat). At the moment Nanolab has two different sets of quartz ware: | ||
*Metal: Dedicated for different samples that cannot be RCA cleaned. Also samples with metals are allowed in the furnace, when this quartz set is mounted | *Metal: Dedicated for different samples that cannot be RCA cleaned. Also samples with metals are allowed in the furnace, when this quartz set is mounted | ||
*Resist pyrolysis: Dedicated for resist pyrolysis. | *Resist pyrolysis: Dedicated for resist pyrolysis. | ||
Please note that all new materials have to be approved by the Thin Film group (thinfilm@ | Please note that all new materials have to be approved by the Thin Film group (thinfilm@nanolab.dtu.dk) before they are allowed in the furnace. | ||
The furnace tube is heated by use of 12 long heaters situated along the furnace tube and combined in three groups (top, bottom left and bottom right) and two flat heaters situated in the ends of the furnace tube. The this way the temperature will be very uniform everywhere in the furnace tube. The heating can be done very fast, up to 30 <sup>o</sup>C/min. For atmospheric pressure processes the maximum temperature is 1100 <sup>o</sup>C, and for vacuum processes the maximum temperature is 1050 <sup>o</sup>C. | The furnace tube is heated by use of 12 long heaters situated along the furnace tube and combined in three groups (top, bottom left and bottom right) and two flat heaters situated in the ends of the furnace tube. The this way the temperature will be very uniform everywhere in the furnace tube. The heating can be done very fast, up to 30 <sup>o</sup>C/min. For atmospheric pressure processes the maximum temperature is 1100 <sup>o</sup>C, and for vacuum processes the maximum temperature is 1050 <sup>o</sup>C. | ||
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'''[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=340 Furnace: Multipurpose annealing]''' | '''[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=340 Furnace: Multipurpose annealing]''' | ||
==Process information== | ==Process information== | ||
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*Annealing: look at the [[Specific Process Knowledge/Thermal Process/Annealing|Annealing]] page | *Annealing: look at the [[Specific Process Knowledge/Thermal Process/Annealing|Annealing]] page | ||
*[[Specific_Process_Knowledge/Thermal_Process/Furnace:_Multipurpose_annealing/Acceptance test|Results from the Multipurpose Anneal Furnace acceptance test]] | *[[Specific_Process_Knowledge/Thermal_Process/Furnace:_Multipurpose_annealing/Acceptance test|Results from the Multipurpose Anneal Furnace acceptance test]] | ||
*[[Specific_Process_Knowledge/Thermal_Process/Pyrolysis/Pyrolysis_with_Multipurpose_Anneal_Furnace|Pyrolysis]] | |||
==Overview of the performance of the ATV furnace and process related parameters== | ==Overview of the performance of the ATV furnace and process related parameters== | ||
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|style="background:LightGrey; color:black"|Film thickness | |style="background:LightGrey; color:black"|Film thickness | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Dry oxidation: 50 Å to ~200 nm SiO<sub>2</sub> (it takes too long to grow a thicker layer) | *Dry oxidation: 50 Å to ~200 nm SiO<sub>2</sub> (it takes too long to grow a thicker oxide layer) | ||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range | ||
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*1-30 50 mm, 100 mm or 150 mm wafers per run | *1-30 50 mm, 100 mm or 150 mm wafers per run | ||
*1-50 200 mm wafers per run (not possible with all quartz sets) | *1-50 200 mm wafers per run (not possible with all quartz sets) | ||
*Smaller samples (placed | *Smaller samples (placed on Si carrier wafers) | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Substrate materials allowed | |style="background:LightGrey; color:black"|Substrate materials allowed | ||