Specific Process Knowledge/Bonding/Wafer Bonder 02: Difference between revisions

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 '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Bonding/Wafer_Bonder_02 click here]'''
+<br>
+<br>
+=Wafer Bonder 02=
+[[Image:wafer bonder2.jpg|300x300px|thumb|Wafer Bonder 02: Positioned in cleanroom E-4]]
 The Wafer bonder 02 is a system for bonding. 3 different types of [[Specific Process Knowledge/Bonding|bonding]] can be done: Anodic, Eutectic and Fusion. Furthermore it is possible to align the wafers one wishes to bond. It is also possible to process and align pieces.
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-[[Image:wafer bonder2.jpg|300x300px|thumb|Wafer Bonder 02: Positioned in cleanroom E-4]]
 ==Process information==
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 *[[Specific Process Knowledge/Bonding/Fusion bonding|Fusion bonding]]
 *[[Specific Process Knowledge/Bonding/Anodic bonding|Anodic bonding]]
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 ==Overview of the performance of the Wafer Bonder 02 and some process related parameters==
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 *Silicon (oxy)nitride
 *Poly Silicon
-*Metals: Au, Sn, Ag, Al, Ti.
+*Metals: Au, Sn, Ag, Al, Ti
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