Specific Process Knowledge/Lithography/NanoImprintLithography: Difference between revisions
Appearance
No edit summary |
|||
| (6 intermediate revisions by 3 users not shown) | |||
| Line 1: | Line 1: | ||
{{cc-nanolab}} | |||
'''Feedback to this section''': '''[mailto:labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/NanoImprintLithography# Imprinter 01 click here]''' | |||
==Imprinter 01== | |||
[[ | [[Image:imprinterfig1.jpg|300x300px|thumb|Imprinter 01: Positioned in cleanroom F-2]] | ||
The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye). | The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye). | ||
| Line 15: | Line 15: | ||
====Imprint information==== | ====Imprint information==== | ||
*[[Specific Process Knowledge/Imprinting|Imprinting]] | |||
<br clear="all" /> | |||
<br clear="all" /> | |||
====Imprint resist information and process flows==== | |||
*[[Specific Process Knowledge/Imprinting|Imprinting]] | *[[Specific Process Knowledge/Imprinting|Imprinting]] | ||
Latest revision as of 14:31, 25 August 2025
The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.
Feedback to this section: Imprinter 01 click here
Imprinter 01

The Imprinter 01 is a system for imprinting in polymers. 2 different types of imprinting can be done: Hot embossing and flash imprint. It is not possible to align the wafers one wishes to imprint (except by eye).
The user manual, user APV, and contact information can be found in LabManager
Imprint information
Imprint resist information and process flows
| Purpose |
| |
|---|---|---|
| Performance | Alignment accuracy |
|
| Process parameter range | Process Temperature |
|
| Process pressure |
| |
| Imprint Pressure |
| |
| Substrates | Batch size |
|
| Substrate material allowed |
| |
| Material allowed on the substrate |
|